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Showing results 1 to 4 of 4

1
CrCu based UBM (under bump metallization) study with electroplated Pb/63Sn solder bumps - Interfacial reaction and bump shear strength

Jang, SY; Wolf, J; Ehrmann, O; Gloor, H; Schreiber, T; Reichl, H; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.26, no.1, pp.245 - 254, 2003-03

2
Investigation of UBM systems for electroplated Sn/37Pb and Sn/3.5Ag solder

Jang, SY; Wolf, J; Ehrmann, O; Gloor, H; Reichl, H; Paik, Kyung-Wook, 51st Electronic Components and Technology Conference, pp.950 - 956, Electronic Components and Technology Conference, 2001-05-29

3
Pb-free Sn/3.5Ag electroplating bumping process and under bump metallization (UBM)

Jang, Se-Young; Wolf, J; Ehrmann, O; Gloor, H; Reichl, H; Paik, Kyung-Wook, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, v.25, no.3, pp.193 - 202, 2002-07

4
(UBM)Under bump metallurgy study for Pb-free bumping

Jang, SY; Wolf, J; Gloor, H; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.31, no.5, pp.478 - 487, 2002-05

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