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Showing results 1 to 4 of 4

1
Hybrid analytical Modeling method for split power bus in multilayered package

Jeong, Y; Lu, ACW; Wai, LL; Fan, W; Lok, BK; Park, H; Kim, Joungho, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.48, pp.82 - 94, 2006-02

2
Low temperature processing for integrated magnetics

Lok, BK; Paik, Kyung-Wook; Wai, LL; Fan, W; Lu, ACW; Pramoda, KP, International Conference on Electronic Materials and Packaging 2007, EMAP 2007, pp.0 - 0, 2007-11-19

3
Solution Space Analysis of Interconnects for Low voltage Differencial Signaling(LVDS)Applications

Kim, Joungho; Ahn, S; Lu, A C W.; Fan, W; Wai, L L, IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (EPEP2001), pp.297 - 330, 2001

4
확장성을 가진 LTCC 기반의 Capacitor 모델

Kim, Joungho; Park, JB; Ryu, C; Shim, Y; Kim, Y; Lu, A.C.W.; Fan, W; et al, 한국군사과학기술학회 2006년 종합학술대회, 2006

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