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Effects of post annealing and oxidation processes on the removal of damage generated during the shallow trench etch process Lee, YJ; Hwang, SW; Oho, KH; Lee, JeongYong; Yeom, GY, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES REVIEW PAPERS, v.37, no.12B, pp.6916 - 6921, 1998-12 |
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