Showing results 1 to 5 of 5
60-GHz system-on-package transmitter integrating sub-harmonic frequency amplitude shift-keying modulator Jung, DY; Chang, WI; Eun, KC; Park, Chul Soon, IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, v.55, pp.1786 - 1793, 2007-08 |
A new low-loss microstrip structure on LTCC substrate Lee, YC; Eun, KC; Park, Chul Soon, IEICE TRANSACTIONS ON ELECTRONICS, v.E86C, no.5, pp.867 - 869, 2003-05 |
Design of an isolated capacitor cell for three-dimensional RF circuit integration Kim, DJ; Lee, YC; Choi, BG; Eun, KC; Park, Chul Soon, MICROWAVE AND OPTICAL TECHNOLOGY LETTERS, v.38, no.6, pp.484 - 486, 2003-09 |
Fully embedded low temperature co-fired ceramics (LTCC) spiral inductors for L-band RF system-in-package (SIP) applications Eun, KC; Lee, YC; Choi, BG; Kim, DJ; Park, Chul Soon, IEICE TRANSACTIONS ON ELECTRONICS, v.E86C, pp.1089 - 1092, 2003-06 |
Ka-band oscillator integrating a high-Q low-temperature co-fired ceramic circular resonator using zigzagged via posts and a lambda/4 short stub Jung, DY; Eun, KC; Park, Chul Soon, IET MICROWAVES ANTENNAS & PROPAGATION, v.2, pp.88 - 92, 2008-02 |
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