Browse "College of Engineering(공과대학)" by Author Pak, Jun-So
Showing results 13 to 14 of 14
| Through-Silicon-Via-Based Decoupling Capacitor Stacked Chip in 3-D-ICs Song, Eun-Seok; Koo, Kyoung-Choul; Pak, Jun-So; Kim, Joung-Ho, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.3, no.9, pp.1467 - 1480, 2013-09 |
| Vertical Stepped Impedance EBG (VSI-EBG) Structure for Wideband Suppression of Simultaneous Switching Noise in Multilayer PCBs Kim, Myung-Hoi; Koo, Kyoung-Choul; Shim, Yu-Jeong; Hwang, Chul-Soon; Pak, Jun-So; Ahn, Seung-Young; Kim, Joung-Ho, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.55, no.2, pp.307 - 314, 2013-04 |
Discover
Open Access
Date issued
- 24,281 2020 - 2024
- 75,432 2010 - 2019
- 57,255 2000 - 2009
- 30,842 1990 - 1999
- 9,025 1980 - 1989