Showing results 34 to 41 of 41
PAM-4 based PCIe 6.0 Channel Design Optimization Method using Bayesian Optimization Kim, Jihun; Kim, Joungho; Park, Hyunwook; Kim, SeongGuk; Choi, Seonguk; Son, Keeyoung; Park, Joonsang; et al, 30th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2021, IEEE, 2021-10-17 |
PCB-package to Chip Wireless Power Transfer Scheme using Magnetic-field Resonance Coupling for High-density 3-D IC Song, Jinwook; Kim, Joungho; Jeong, Seungtaek; Park, Shinyoung; Kim, Jonghoon; Cho, Yeonje, IEEE Wireless Power Transfer Conference 2016, IEEE Wireless Power Transfer Conference 2016, 2016-05-05 |
Probe Card Design with Signal and Power Integrity for Wafer-level Application Processor Test in LPDDR Channel Kim, Joungho; Song, Jinwook; Lee, Eunjung; Kim, Jonghoon; Park, Shinyoung; Park, Jeoung Keun; Park, Jong Hyun; et al, 66th Electronic Components and Technology Conference (ECTC), 66th Electronic Components and Technology Conference (ECTC), 2016-05-31 |
Safety and reliability verification process of coil module in wireless power transfer system using circuit level sensitivity simulation Kim, Jonghoon; Kim, Jonghoon J; Kim, Hongseok; Song, Chiuk; Song, Jinwook; Cho, Yeonje; Kim, Sukjin; et al, IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015, pp.144 - 147, Institute of Electrical and Electronics Engineers Inc., 2015-12 |
Scalable Transformer Network-based Reinforcement Learning Method for PSIJ Optimization in HBM Park, Hyunwook; Kim, Joungho; Shin, TaeIn; Kim, SeongGuk; Lho, Daehwan; Sim, BooGyo; Song, Jinwook; et al, 31st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2022, IEEE, 2022-10-10 |
Signal Integrity Design and Analysis of Differential High-Speed Serial Links in Silicon Interposer With Through-Silicon Via Cho, Kyungjun; Kim, Youngwoo; Lee, Hyunsuk; Song, Jinwook; Park, Junyong; Lee, Seongsoo; Kim, Subin; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.9, no.1, pp.107 - 121, 2019-01 |
Signal Integrity Design and Analysis of Silicon Interposer for GPU-Memory Channels in High-Bandwidth Memory Interface Cho, Kyungjun; Kim, Youngwoo; Lee, Hyunsuk; Kim, Heegon; Choi, Sumin; Song, Jinwook; Kim, Subin; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.8, no.9, pp.1658 - 1671, 2018-09 |
Smartwatch Strap Wireless Power Transfer System with Flexible PCB Coil and Shielding Material Jeong, Seungtaek; Kim, Dong-Hyun; Song, Jinwook; Kim, Hongseok; Lee, Seongsoo; Song, Chiuk; Kim, Joungho; et al, IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS, v.66, no.5, pp.4054 - 5064, 2019-05 |
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