Browse "College of Engineering(공과대학)" by Author Song, Jinwook
Showing results 14 to 41 of 41
| Deep Reinforcement Learning-based Channel-flexible Equalization Scheme: An Application to High Bandwidth Memory Choi, Seonguk; Kim, Joungho; Park, Hyunwook; Kim, Haeyeon; Park, Joonsang; Son, Keeyoung; Kim, SeongGuk; et al, DesignCon 2022, DesignCon, 2022-04-07 |
| Deep Reinforcement Learning-Based Optimal and Fast Hybrid Equalizer Design Method for High-Bandwidth Memory (HBM) Module Choi, Seonguk; Son, Keeyoung; Park, Hyunwook; Kim, Seongguk; Sim, Boogyo; Kim, Jihun; Park, Joonsang; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.13, no.11, pp.1804 - 1816, 2023-11 |
| Design and Analysis of Chip-level Wireless Power Transfer Using Magnetic-field Resonance Coupling and 0.18 um CMOS Technology Kim, Joungho; Song, Jinwook; Jeong, Seungtaek; Park, Shinyoung, Asia-Pacific International Symposium on Electromagnetic Compatibility, Asia-Pacific International Symposium on Electromagnetic Compatibility, 2017-06-22 |
| Design and Analysis of Interposer-level Integrated Voltage Regulator for Power Noise Suppression in High Bandwidth Memory I/O Interface Kim, Subin; Kim, Youngwoo; Cho, Kyungjun; Song, Jinwook; Park, Shinyoung; Park, Junyong; Park, Hyunwook; et al, 27th IEEE Conference on Electrical Performance on Electronic Packaging and Systems (EPEPS), pp.159 - 161, IEEE, 2018-10-15 |
| Design and analysis of on-interposer active power distribution network for an efficient simultaneous switching noise suppression in 2.5D IC Kim, Subin; Kim, Youngwoo; Cho, Kyungjun; Song, Jinwook; Kim, Joungho, IEEE International 3D Systems Integration Conference, 3DIC 2016, Institute of Electrical and Electronics Engineers Inc., 2017-11 |
| Design and Analysis of On-interposer Active Power Dsitribution Network for an Efficient Simultaneous Switching Noise Kim, Joungho; Cho, Kyungjun; Song, Jinwook, IEEE International Conference on 3D Systems Integration (3D IC 2016), IEEE International Conference on 3D Systems Integration (3D IC 2016), 2016-11-11 |
| Design and analysis of wireless power transfer scheme on active silicon interposer for high density and high bandwidth 2.5D/3D-IC = 고밀도 고대역 2.5차원/3차원 집적회로를 위한 능동 실리콘 인터포저에서의 무선 전력 전송 도식 설계 및 분석link Song, Jinwook; 송진욱; et al, 한국과학기술원, 2015 |
| Design and Analysis of Wireless Power Transfer System using Flexible Coil and Shielding Material on Smartwatch Strap Kim, Joungho; Jeong, Seungtaek; Song, Jinwook; Kim, Hongseok; Lee, Seongsoo, IEEE Wireless Power Transfer Conference 2017, IEEE Wireless Power Transfer Conference 2017, 2017-05-11 |
| Design and Measurement of a Novel On-Interposer Active Power Distribution Network for Efficient Simultaneous Switching Noise Suppression in 2.5-D/3-D IC Kim, Subin; Kim, Youngwoo; Cho, Kyungjun; Song, Jinwook; Kim, Joungho, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.9, no.2, pp.317 - 328, 2019-02 |
| Design of an on-interposer passive equalizer embedded on a ground plane for 30Gbps serial data transmission Jeon, Yeseul; Kim, Heegon; Choi, Sumin; Song, Jinwook; Kim, Youngwoo; Kim, Joungho, IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015, pp.50 - 53, Institute of Electrical and Electronics Engineers Inc., 2015-12 |
| Design, Simulation and Measurement of Flexible PCB Coils for Wearable Device Wireless Power Transfer Jeong, Seungtaek; Song, Jinwook; Lee, Seongsoo; Hong, Seokwoo; Sim, Boogyo; Kim, Hongseok; Kim, Subin; et al, IEEE MTT-S Wireless Power Transfer Conference (WPTC 2018), IEEE MTT-S Wireless Power Transfer Conference (WPTC 2018), 2018-06-05 |
| Dual-Directional Near Field Communication Tag Antenna with Effective Magnetic Field Isolation from Wireless Power Transfer System Kim, Joungho; Lee, Seongsoo; Jeong, Seungtaek; Kim, Dong-Hyun; Song, Jinwook; Kim, Hongseok, IEEE Wireless Power Transfer Conference 2017, IEEE Wireless Power Transfer Conference 2017, 2017-05-10 |
| Electromagnetic Bandgap Design for Power Distribution Network Noise Isolation in the Glass Interposer Kim, Joungho; Kim, Youngwoo; Song, Jinwook; Kim, Subin; Venky, Sundaram; Ao, Tummala; Cho, Jonghyun, 66th Electronic Components and Technology Conference (ECTC), 66th Electronic Components and Technology Conference (ECTC), 2016-05-31 |
| How to Manage TDMA Power Amplifier Switching Noise Coupling to Audio CODECs in Mobile Phones Kim, Joungho; Park, Shinyoung; Song, Jinwook; Kim, Subin; Kim, Youngwoo, DesignCon 2018, DesignCon 2018, 2018-01-31 |
| Hybrid Metamaterial with Zero and Negative Permeability to Enhance Efficiency in Wireless Power Transfer System Kim, Joungho; Lee, Seongsoo; Jeong, Seungtaek; Kim, Hongseok; Song, Chiuk; Yoon, Kibum; Song, Jinwook; et al, IEEE Wireless Power Transfer Conference 2016, IEEE Wireless Power Transfer Conference 2016, 2016-05-05 |
| Imitation Learning for Simultaneous Escape Routing Kim, Minsu; Kim, Joungho; Park, Hyunwook; Son, Keeyoung; Kim, SeongGuk; Kim, Haeyeon; Song, Jinwook, 30th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2021, IEEE, 2021-10-17 |
| Imitation Learning with Bayesian Exploration (IL-BE) for Signal Integrity (SI) of PAM-4 based High-speed Serial Link: PCIe 6.0 Kim, Jihun; Kim, Joungho; Park, Hyunwook; Yoon, Jiwon; Choi, Seonguk; Park, Joonsang; Kim, HaeYeon; et al, DesignCon 2022, DesignCon, 2022-04-05 |
| Low Leakage Electromagnetic Field level and High Efficiency using A Novel Hybrid Loop-array Design for Wireless High Power Transfer System Lee, Seongsoo; Kim, Dong-Hyun; Cho, Yeonje; Kim, Hongseok; Song, Chiuk; Jeong, Seungtaek; Song, Jinwook; et al, IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS, v.66, no.6, pp.4356 - 4367, 2019-06 |
| Modeling, Measurement, and Analysis of Audio Frequency Ground Integrity for a TDMA Smartphone System Park, Shinyoung; Song, Jinwook; Kim, Subin; Kim, Youngwoo; Lee, Man Ho; Kim, Joungho, IEEE Transactions on Components, Packaging and Manufacturing Technology, v.8, no.4, pp.519 - 530, 2018-04 |
| Multi-layer Probe Card Design with Signal/Power Integrity for Wafer-level AP Test in LPDDR4 Channel Song, Jinwook; Kim, Joungho; Lee, Eunjung; Kim, Jonghoon; Park, Shinyoung; Park, Jeoung Keun; Park, Jong Hyun; et al, IEEE International Conference on Signal and Power Integrity (SIPI 2016), pp.547 - 552, Institute of Electrical and Electronics Engineers Inc., 2016-07-27 |
| PAM-4 based PCIe 6.0 Channel Design Optimization Method using Bayesian Optimization Kim, Jihun; Kim, Joungho; Park, Hyunwook; Kim, SeongGuk; Choi, Seonguk; Son, Keeyoung; Park, Joonsang; et al, 30th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2021, IEEE, 2021-10-17 |
| PCB-package to Chip Wireless Power Transfer Scheme using Magnetic-field Resonance Coupling for High-density 3-D IC Song, Jinwook; Kim, Joungho; Jeong, Seungtaek; Park, Shinyoung; Kim, Jonghoon; Cho, Yeonje, IEEE Wireless Power Transfer Conference 2016, IEEE Wireless Power Transfer Conference 2016, 2016-05-05 |
| Probe Card Design with Signal and Power Integrity for Wafer-level Application Processor Test in LPDDR Channel Kim, Joungho; Song, Jinwook; Lee, Eunjung; Kim, Jonghoon; Park, Shinyoung; Park, Jeoung Keun; Park, Jong Hyun; et al, 66th Electronic Components and Technology Conference (ECTC), 66th Electronic Components and Technology Conference (ECTC), 2016-05-31 |
| Safety and reliability verification process of coil module in wireless power transfer system using circuit level sensitivity simulation Kim, Jonghoon; Kim, Jonghoon J; Kim, Hongseok; Song, Chiuk; Song, Jinwook; Cho, Yeonje; Kim, Sukjin; et al, IEEE Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2015, pp.144 - 147, Institute of Electrical and Electronics Engineers Inc., 2015-12 |
| Scalable Transformer Network-based Reinforcement Learning Method for PSIJ Optimization in HBM Park, Hyunwook; Kim, Joungho; Shin, TaeIn; Kim, SeongGuk; Lho, Daehwan; Sim, BooGyo; Song, Jinwook; et al, 31st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2022, IEEE, 2022-10-10 |
| Signal Integrity Design and Analysis of Differential High-Speed Serial Links in Silicon Interposer With Through-Silicon Via Cho, Kyungjun; Kim, Youngwoo; Lee, Hyunsuk; Song, Jinwook; Park, Junyong; Lee, Seongsoo; Kim, Subin; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.9, no.1, pp.107 - 121, 2019-01 |
| Signal Integrity Design and Analysis of Silicon Interposer for GPU-Memory Channels in High-Bandwidth Memory Interface Cho, Kyungjun; Kim, Youngwoo; Lee, Hyunsuk; Kim, Heegon; Choi, Sumin; Song, Jinwook; Kim, Subin; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.8, no.9, pp.1658 - 1671, 2018-09 |
| Smartwatch Strap Wireless Power Transfer System with Flexible PCB Coil and Shielding Material Jeong, Seungtaek; Kim, Dong-Hyun; Song, Jinwook; Kim, Hongseok; Lee, Seongsoo; Song, Chiuk; Kim, Joungho; et al, IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS, v.66, no.5, pp.4054 - 5064, 2019-05 |
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