Browse "College of Engineering(공과대학)" by Type Conference
Showing results 69901 to 69920 of 90952
| Thermo-Mechanical Behavior of Molded Underfill Filling the Sub-100μm Die Gap for Advanced Packaging Ju, Min Sang; Kim, Junmo; Gu, Chang-Yeon; Song, Myoung; Ma, Sung Woo; Lee, Jin Hee; Lee, Woong-Sun; et al, The 21st International Symposium on Microelectronics and Packaging (ISMP), The Korean Microelectronics and Packaging Society, 2023-10-27 |
| Thermo-mechanical Finite Element Analysis of Fuel Pellets Containing Lump Burnable Absorbers 김형진; 류호진, 한국원자력학회 2023 추계학술발표회, 한국원자력학회, 2023-10-26 |
| Thermo-Mechanical Reliability Assessment of Thin Electronic Packages with High Density Interconnects using Moire Methods Lee, Soon-Bok, SEM Fall Conference 2014, SEM Fall Conference 2014, 2014-10-21 |
| Thermo-Mechanical Reliability of the Benzocyclobutane(BCB) film in a WLCSP Process Yu, Jin; Lee, KO; Kim, JY; Park, IS, Proc.3rd Electronic Materials and Packaging, pp.84 - 87, 2001 |
| Thermo-Mechanical Stress Analysis of Lamination Based MCM-D Substrate 백경욱, 제6회 한국반도체 학술대회, pp.269 - 272, 한국반도체 학술대회, 1999-02-01 |
| Thermo-Mechanical Stresses in Laminated Polymer Films on Silicon Substrates Paik, KW; Kim, JS; Oh, SH; Seo, HS, 제5회 한국반도체 학술대회, pp.587 - 588, 한국반도체 학술대회, 1998-02-01 |
| Thermo-Mechanical Stresses in Laminated Polymer Films on Silicon Substrates Paik, Kyung-Wook; Kim, JS; Oh, SH; Seo, HS, International Conference and Exhibition on Multichip Modules and High Density Packaging, pp.449 - 453, International Conference and Exhibition on Multichip Modules and High Density Packaging, 1998-04-01 |
| Thermo-Mechanical Stresses in Lamination Based Si Monolithic MCM-D Substrates Paik, Kyung-Wook, Materials Research Society Spring Meeting, pp.192 - 192, 1998-05-01 |
| Thermo-message: Exploring the potential of heat as a modality of peripheral expression Lee, Wonjun; Lim, Youn-kyung, 28th Annual CHI Conference on Human Factors in Computing Systems, CHI 2010, pp.4231 - 4236, ACM Special Interest Group on Computer-Human Interaction (SIGCHI), 2010-04-10 |
| Thermo-Optic Characteristics and Applications of the Sol-Gel Hybrid Material Films Bae, Byeong-Soo, The 5th International Meeting of Pacific Rim Ceramic Societies, 2003 |
| Thermo-optic tunable grating structure for coupler and radiator applications in silicon Kim, Seong-Hwan; Kim, Jong Hun; Yeo, Sanggu; Kang, Geumbong; Kim, Jeongyoon; Yoo, Dongeun; Lee, Harin; et al, SPIE Photonics West 2017, SPIE, 2017-02-01 |
| Thermo-physical properties of bulk Gd2O3 for fuel performance analysis of a lumped burnable absorber fuel design MISTARIHI QUSA; 류호진; Sweidan, Faris, 한국원자력학회 2017 추계학술대회, 한국원자력학회, 2017-10-26 |
| Thermo-Responsive Microcapsules for Localized Photothermal Heating and Controlled Release of Drugs Han, Sang Hoon; Kim, Ji-Won; Kim, Shin-Hyun, IUPAC-MACRO 2020+, International Union of Pure and Applied Chemistry, 2021-05-18 |
| Thermo-Responsive Microcapsules with Tunable Cut-Off Threshold of Molecular Permeation for Temperature-Controlled Encapsulation and Release CHOI, YEHUN; Jeon, Seog-Jin; Kim, Shin-Hyun, 2021 MRS Spring Meeting & Exhibit, Materials Research Society, 2021-04-21 |
| Thermo-Responsive Microcapsules with Tunable Cut-Off Threshold of Transmembrane Permeation CHOI, YEHUN; Jeon, Seog-Jin; Kim, Shin-Hyun, IUPAC-MACRO 2020+, International Union of Pure and Applied Chemistry, 2021-05-19 |
| Thermo-Responsive Microcapsules with Tunable Molecular-Size-Selective Permeation 최예훈; 전석진; 김신현, 한국고분자학회 2020 추계학술대회, 한국고분자학회, 2020-10-07 |
| Thermo-Rigid Viscoplastic Finite Element Approach for Flow Simulation of Compression Molding of Thermoset Composites Kim, S.Y; Cheon, J.S; Im, Yong-Taek, Pacific Forum on Intelligent Processing and Manufacturing of Materials , pp.857 - 863, 1997-07 |
| Thermo-sensitive sol-gel transition behavior of star-shaped PEG-PLGA-PEG aqueous solution 김성철, 한국고분자학회 추계학술발표회, 2002 |
| Thermo-sensutive microparticels of poly(N-isopropylacrylamide) grafted ethylcellulose by the spray drying method Kim, Jong-Duk, 10th international symposium on recent advances in drug delivery systems, pp.0 - 0, 2001-03-01 |
| Thermo-Viscoplasic Analysis of Hypersonic Structures Subjected to Severe Aerodynamic Heating Thornton, EA; Oden, JT; Tworzydlo, WW; Youn, Sung-Kie, AIAA/ASME/ASCE/AHS 30th Structures, Structural Dynamics and Materials, and materials Conference, 1989 |
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- 23,005 2020 - 2024
- 75,360 2010 - 2019
- 57,250 2000 - 2009
- 30,842 1990 - 1999
- 9,025 1980 - 1989