Browse "College of Engineering(공과대학)" by Type Conference
Showing results 65361 to 65380 of 90918
| Studies on cyclic behaviors of the unit bucket for tripod foundation system under various loadings via centrifuge model tests Jeong, Yeong Hoon; Kim, Dong-Soo; Kim, Jae Hyun; Parkn Hun Jun, Geo-Congress 2019, ASCE, 2019-03-25 |
| Studies on double-layered metal bumps for fine pitch flip chip applications Son, HY; Yeo, YW; Jung, GJ; Lee, JK; Choi, JY; Park, CJ; Suh, MS; et al, EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging, v.2005, pp.95 - 100, 2005-12-11 |
| Studies on growth of monodispersed silica particles by sol-gel method 양승만, 한국화학공학회 춘계학술발표회, pp.953 - 956, 한국화학공학회, 1998-04-01 |
| Studies on Microvoids at the Interface of Direct Bonded Silicon Wafers 강상원, 제2회 한국진공학회 학술발표회, 1992 |
| Studies on Ni-Sn Intermetallic Compound and P-rich Ni Layer at the Electroless Nickel (NiP)-Solder Interface and Their Effects on Flip Chip Solder Joint Reliability 전영두; 백경욱, 한국 마이크로 전자 및 패키징학회 추계 기술심포지움, pp.67 - 71, 한국 마이크로 전자 및 패키징학회, 2000-11-01 |
| Studies on Ni-Sn intermetallic compound and P-rich Ni layer at the electroless Nickel UBM - Solder interface and their effects on flip chip solder joint reliability Jeon, YD; Paik, Kyung-Wook; Bok, KS; Choi, WS; Cho, CL, 51st Electronic Components and Technology Conference, pp.1326 - 1332, IEEE, 2001-05-29 |
| Studies on Preparation of Monodispersed Silica Particles using Sol-Gel Method and Rheological Behaviors of Silica Dispersion 양승만, 한국화학공학회 춘계학술발표회, pp.905 - 908, 한국화학공학회, 1996-04-01 |
| Studies On PVA-PVDF Based Solid Polymer Blend Electrolytes Lee, Jai Young, 6th International Conference on New Energy Systems and Conversions, 2003 |
| Studies on the application of supercritical carbon dioxide cycle to a small modular reactor Yoon,HJ; Ahn,Y; Lee,JH; Lee, JeongIk, International Congress on Advances in Nuclear Power Plants 2011 (ICAPP 2011), French Nuclear Energy Society, 2011-05 |
| Studies on the Biodegradation of Polyurethanes under Compositing Conditions. Kim, Sung Chul, Pacific Polymer Conference, 1997 |
| Studies on the dimensional and piezoelectric characteristics of 3D printed piezoelectric structures KIM, InSup; Yoon, Yong Jin, International Symposium on Precision Engineering and Sustainable Manufacturing, PRESM 2021, 한국정밀공학회, 2021-07-21 |
| Studies on the High Temperatute Superconductor (HTS)/Metal/Polymer Dielectric Interconnect Structure for Packaging Applications Paik, Kyung-Wook; Mogro-Campero, A; Turner, L, 44th ECTC Proceeding, pp.326 - 336, 1994-03-01 |
| Studies on the interfacial reactions between electroless Ni UBM and 95.5Sn-4.0 Ag-0.5 Cu alloy Jeon, YD; Nieland, S; Ostmann, A; Reichl, H; Paik, Kyung-Wook, 52nd Electronic Components and Technology Conference, pp.740 - 746, IEEE, 2002-05-28 |
| Studies on the Interfacial Tensions of Liquid Metal-Fluid Systems 류가빈; 김형수, 재 12회 한국유체공학학술대회, 한국전산유체공학회, 2022-06-23 |
| Studies on the Microvoids at the Interface of Direct Bonded Silicon Wafers Sang-Won Kang, ESC Proc. of the 1st Interanational Conf. on Semiconductor Wafer Bonding, Science, Technology and Application, pp.102 -, 1991 |
| Studies on the modification of Epoxy resin with polydimethylsiloxane Kim, Sung Chul, 36th IUPAC international symposium on macromolecules, 1996 |
| Studies on the Surface Morphology of BCB films by Plasma Ions Paik, Kyung-Wook; Saia, RJ; Chera, JJ, Proc. Mat. Res. Soc. Symp, pp.303 - 308, 1991-03-01 |
| Studies on the synthesis of mesoporous molecular sieves, MCM-41 and its potential applicability to hydrotreating catalyst system 김충현; 홍석봉; 우성일, 한국화학공학회 춘계학술발표회, pp.963 -, 한국화학공학회, 1995-04 |
| Studies on the thermal cycling reliability of fine pitch Cu/SnAg double-bump flip chip assemblies on organic substrates: Experimental results and numerical analysis Son, HY; Paik, KW; Kim, I; Park, JH; Lee, Soon-Bok; Jung, GJ; Park, BJ; et al, 10th Electronics Packaging Technology Conference, EPTC 2008, pp.716 - 724, 2008-12-09 |
| Studies on the thermal cycling reliability of fine pitch Cu/SnAg double-bump flip chip assemblies on organic substrates: Experimental results and numerical analysis Son H.-Y.; Kim I.; Park J.-H.; Lee S.-B.; Jung G.-J.; Park B.-J.; Paik, Kyung-Wook, 2008 58th Electronic Components and Technology Conference, ECTC, pp.2035 - 2043, 2008-05-27 |
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