Showing results 49481 to 49500 of 91091
Noise analysis of a wavelength-locked Fabry-Perot laser diode Park, K.-Y.; Lee, Chang-Hee, 2008 7th International Conference on the Optical Internet, COIN 2008, pp.1 - 2, 2008-10-14 |
Noise analysis of cylindrical roller bearings Rho B.-H.; Kim D.-G.; Kim, Kyung-Woong, 2004 ASME/STLE International Joint Tribology Conference, pp.765 - 770, 2004-10-24 |
Noise and Gain Optimization Technique for RF Integrated CMOS Low Noise Amplifier Lee, Sang-Gug, IEEE International Conference on Electronic Devices and Solid-State Circuits, v.0, no.0, pp.221 - 224, IEEE International Conference on Electronic Devices and Solid-State Circuits, 2003-12-01 |
Noise and Interference Characterization for MLC Flash Memories Moon, Jaekyun; No, J.; Lee, S.; Kim, S.; Yang, J.; Chang, S., International Conference on Computing, Networking and Communications 2012, IEEE, 2012-01-30 |
Noise and Vibration Characteristics of Externally Pressurized Slot-Restricted Air Journal Bearings Rho, BH; Kim, Kyung-Woong, STLE/ASME International Joint Tribology Conference, 2003-10-26 |
Noise and Vibration Phenomena of On-Line Electric Vehicle Shin, Eun-Gyeong; Ahlswede, Michael; Muenzberg, Christopher; Suh, In-Soo; Engel, Ferhat, SAE 2011 Noise and Vibration Conference and Exhibition, SAE, 2011-04 |
Noise aware depth denoising for a time-of-flight camera Kweon, In-So; Jung, Jiyoung; Lee, Joon Young, 20th Korea-Japan Joint Workshop on Frontiers of Computer Vision, Asian Federation of Computer Vision (AFCV), 2014-02-05 |
Noise bandwidth suppression circuit for low noise IRFPA Kim, B.; Kang, S.-G.; Lee, Hee Chul; Kim, C.-K., Infrared Technology and Applications XXVIII, v.4820, no.1, pp.327 - 333, 2002-07-07 |
Noise cancelling with autoassociative memory trained by order statistics Bae, J; Ryu, Y; Song, Iickho, Proceedings of the 1994 IEEE International Conference on Neural Networks. Part 1 (of 7), v.5, pp.3431 - 3436, 1994-06-27 |
Noise Capacitive Sensor for Multi-Touch Mobile Handset's Applications Ko, S.; Shin, H.; Lee, J.; Jang, H.; So, B.-C.; Yun, I.; Lee, Kwyro, IEEE ASIAN SOLID-STATE CIRCUITS CONF., pp.113 - 116, IEEE, 2009-12 |
Noise Characteristics of Contra-Rotating Open Rotor with Time-Spectral CFD and Aeroacoustics Analysis Yi, Seulgi; Kwon, Hyungil; Im, Dong Kyun; Choi, Seongim; Lee, Duck Joo, AIAA SciTech 2016, AMER INST AERONAUT ASTRONAUT, 2016-01-06 |
Noise Characteristics of Pile Driving Operation and Design of a Low-Noise Pile Cap Based on the Scale Model Experiment Ih, Jeong-Guon, Inter-Noise 2003, pp.0 - 0, 2003-08-01 |
Noise control of zones: its theory and applications Jin-Young Park; Min-Ho Song; Jung-Min Lee; Tae-Woong Lee; Ji-Ho Chang; Kim, Yang-Hann, InterNoise 2010, Institute of Noise Control Engineering, 2010-06-16 |
Noise Coupling Analysis between TSV and Active Circuit Kim, Joungho; Jonghyun Cho, 2012 IEEE Electrical Design of Advanced Package & Systems Symposium, EDAPS2012, 2012-12-10 |
Noise coupling analysis method for an electronic safety and arming device (ESAD) Kang, Hyungmin; Kim, Subin; Lho, Daehwan; Park, Hyunwook; Sim, Boogyo; Kim, Joungho, 2019 Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2019, Institute of Electrical and Electronics Engineers Inc., 2019-12 |
Noise Coupling and Shielding in Through-Silicon Via (TSV)-based 3D IC Cho, Jonghyun; Kim, Joohee; Pak, Jun So; Lee, Junho; Lee, Hyungdong; Park, Kunwoo, 2011 Asia-Pacific Symposium on Electromagnetic Compatibility, 2011 Asia-Pacific Symposium on Electromagnetic Compatibility, 2011-05-17 |
Noise coupling emulation between TSV and active circuit through metal oxide patch Kim, Joungho; Jonghyun Cho; Jaemin Lim, 65th Electronic Components and Technology Conference (ECTC), 65th Electronic Components and Technology Conference (ECTC), 2015-05-28 |
Noise Coupling Modeling and Analysis of Through Glass Via(TGV) Kim, Joungho; Kim, Jihye; Kim, Youngwoo; Cho, Jonghyun; Venky Sundaram; Rao Tummala, IEEE International 3D Systems Integration Conference (3DIC), IEEE International 3D Systems Integration Conference (3DIC), 2015-08-31 |
Noise Coupling of Through-Via in Silicon and Glass Interposer Kim, Joungho; Manho Lee; Jonghyun Cho; Joohee Kim; Jiseong Kim, ECTC Conference, ECTC Conference, 2012-05-29 |
Noise Coupling of Through-Via in Silicon and Glass Interposer Kim, Joungho; Jonghyun Cho; Joohee Kim; Jiseoung Kim, 63rd Electronic Components and Technology Conference (ECTC), pp.1806 - 1810, ECTC2013, 2013-05-19 |
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