Showing results 44241 to 44260 of 91054
Measurement of sub-micrometer features based on the topographic contrast using reflection confocal microscopy Gweon, Dae-Gab; Lee, SW; Kang, DK; Yoo, HK; Kim, TJ; Lee, SW; Kim, KS, 2nd International Symposium on Nano-manufacturing, Optical Society of Korea, 2004-11-03 |
Measurement of Surface Plasmon Polariton Characteristics in Nano Slit - Groove with Phase Spectroscopy Kim, Dae Hee; Lee, Injae; Park, Yeongho; Park, Junhyeong; Kim, Seung-Woo; KIM, Young-Jin, The 18th IEEE International Conference on Nano/Micro Engineered and Molecular Systems (IEEE NEMS 2023), IEEE-NEMS(nano/micro engineering molecular system), 2023-05-16 |
Measurement of Surface Properties Using Pressure/Temperature Sensitive Paints in a Supersonic Wind Tunnel Jang, Byungkook; PARK, GISU, The 34th International Symposium on Shock Waves, National Symposium on Shock Waves Korea, 2023-07-18 |
Measurement of tag confidence in user generated contents retrieval Lee, S.; Min, H.-S.; Lee, Y.B.; Ro, YongMan, Visual Communications and Image Processing 2009, v.7257, SPIE, 2009-01-20 |
Measurement of Temperature Profile Using the Infrared Thermal Camera in Turbulent Stratified Liquid Flow for Estimation of Condensation Heat Transfer Coefficients No, Hee Cheon; Choi, Sung Won, 한국원자력학회 춘계발표회, 한국원자력학회, 1999 |
Measurement of the 3-D shapes of specular objects using recursive triangulation Cho, Hyungsuck, Pacific Conf. On Manufacturing, pp.389 - 394, 1996 |
Measurement of the Acoustic Source Characteristics of the Intake Port in the Refrigerator Compressor Ih, Jeong-Guon; Jang, SH; Kim, SJ; Shim, JS, 1998 International Compressor Engineering Conference, pp.561 - 564, 1998 |
Measurement of the Catheter Motion for Catheter Simulation LI, CHENGJIE; Lee, Doo Yong, 2021 The 21st International Conference on Control, Automation and Systems (ICCAS 2021), ICCAS, 2021-10-14 |
Measurement of the DBTT in 3.4% silicon steel by tensile tests at high strain rate using a servo-hydraulic machine Kwon, Junbeom; Huh, Hoon; Kim, Jae Song, WCCM XII&APCOM VI, The Secretariat of WCCM XII & APCOM VI, 2016-07-28 |
Measurement of the degree of cure of glass fiber-epoxy composites using dielectrometry Bang K.G.; Kwon J.W.; Lee, Dai Gil; Lee J.W., 5th Asia Pacific Conference on Materials Processing, v.113, no.40546, pp.209 - 214, 2001-06-25 |
Measurement of the effect of surface topology on friction by tip test Im, Yong-Taek; Jung, K.-H.; Lee, H.-C.; Ajiboye, J.S.; Kang, S.-H., ASME International Manufacturing Science and Engineering Conference 2009, MSEC2009, pp.593 - 601, ASME, 2009-10-04 |
Measurement of the Effective Internet Diameter Based on Hop Counts of Effective Connections 김재균, KISS, 1999 |
Measurement of the Rotor Blade Deformation Using Stereo Cameras and Distributed Fiber Bragg Grating Sensors Han, Jae-Hung; Kim, H.-I; Park, J.-W, ICAAT 2010 International Conference on Advanced Aircraft Technologies, pp.3 - 5, 2010-08-31 |
Measurement of the Size of Electrosprayed Droplets Emitted from the Taylor Cone in Vacuum Ku, BK; Kim, Sang Soo, 19th Annual Conference of the American Association for Aerosol Research (AAAR), The American Association for Aerosol Research(AAAR), 2000-11-06 |
Measurement of the space-time relation in quantum coherence propagation Wang, L.J.; Rhee, June-Koo Kevin, International Quantum Electronics Conference, vol. 7, 1998 OSA Technical Digest Series, pp.134 - 135, OSA, 1998-05 |
Measurement of the Thermal Expansion for Space Structures Using Fiber Bragg Grating Sensors and Displacement Measuring Kim, H.-I.; Kang, L.-H.; Han, Jae-Hung, ASME Conference on Smart Materials, Adaptive Structures and Intelligent Systems, SMASIS2008, pp.387 - 395, American Society of Mechanical Engineers, 2008-10-30 |
Measurement of Thermal Deformations of Chip Scale Packages Using Moire Interferometry Ham, SJ; Hwang, TK; Lee, Soon-Bok, SEMICON Korea Technical Symposium 2001, Serial 14, pp.239 - 244, 2001 |
Measurement of Thermal Deformations of Electronic packages using Moire Interferometry Lee, Soon-Bok; Ham, SJ, KSME 2000 Conference of Materials and Frcture Division, pp.314 - 320, 2000 |
Measurement of Thermal Expansion Coefficient of FR4 Using Digital Image Correlation System for Warpage Prediction of Package Substrate Lee, TI; Kim, C; Kim, MS; 김택수, 2014 KSPE Fall Meeting, KSPE, 2014-10-29 |
Measurement of thermal expansion coefficient of poly-si using microgauge sensors Chae J.-H.; Lee J.-Y.; Kang S.-W., Smart Electronics and MEMS, v.3242, pp.202 - 211, 1997-12-11 |
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