Browse "College of Engineering(공과대학)" by Type Conference

Showing results 44241 to 44260 of 91054

44241
Measurement of sub-micrometer features based on the topographic contrast using reflection confocal microscopy

Gweon, Dae-Gab; Lee, SW; Kang, DK; Yoo, HK; Kim, TJ; Lee, SW; Kim, KS, 2nd International Symposium on Nano-manufacturing, Optical Society of Korea, 2004-11-03

44242
Measurement of Surface Plasmon Polariton Characteristics in Nano Slit - Groove with Phase Spectroscopy

Kim, Dae Hee; Lee, Injae; Park, Yeongho; Park, Junhyeong; Kim, Seung-Woo; KIM, Young-Jin, The 18th IEEE International Conference on Nano/Micro Engineered and Molecular Systems (IEEE NEMS 2023), IEEE-NEMS(nano/micro engineering molecular system), 2023-05-16

44243
Measurement of Surface Properties Using Pressure/Temperature Sensitive Paints in a Supersonic Wind Tunnel

Jang, Byungkook; PARK, GISU, The 34th International Symposium on Shock Waves, National Symposium on Shock Waves Korea, 2023-07-18

44244
Measurement of tag confidence in user generated contents retrieval

Lee, S.; Min, H.-S.; Lee, Y.B.; Ro, YongMan, Visual Communications and Image Processing 2009, v.7257, SPIE, 2009-01-20

44245
Measurement of Temperature Profile Using the Infrared Thermal Camera in Turbulent Stratified Liquid Flow for Estimation of Condensation Heat Transfer Coefficients

No, Hee Cheon; Choi, Sung Won, 한국원자력학회 춘계발표회, 한국원자력학회, 1999

44246
Measurement of the 3-D shapes of specular objects using recursive triangulation

Cho, Hyungsuck, Pacific Conf. On Manufacturing, pp.389 - 394, 1996

44247
Measurement of the Acoustic Source Characteristics of the Intake Port in the Refrigerator Compressor

Ih, Jeong-Guon; Jang, SH; Kim, SJ; Shim, JS, 1998 International Compressor Engineering Conference, pp.561 - 564, 1998

44248
Measurement of the Catheter Motion for Catheter Simulation

LI, CHENGJIE; Lee, Doo Yong, 2021 The 21st International Conference on Control, Automation and Systems (ICCAS 2021), ICCAS, 2021-10-14

44249
Measurement of the DBTT in 3.4% silicon steel by tensile tests at high strain rate using a servo-hydraulic machine

Kwon, Junbeom; Huh, Hoon; Kim, Jae Song, WCCM XII&APCOM VI, The Secretariat of WCCM XII & APCOM VI, 2016-07-28

44250
Measurement of the degree of cure of glass fiber-epoxy composites using dielectrometry

Bang K.G.; Kwon J.W.; Lee, Dai Gil; Lee J.W., 5th Asia Pacific Conference on Materials Processing, v.113, no.40546, pp.209 - 214, 2001-06-25

44251
Measurement of the effect of surface topology on friction by tip test

Im, Yong-Taek; Jung, K.-H.; Lee, H.-C.; Ajiboye, J.S.; Kang, S.-H., ASME International Manufacturing Science and Engineering Conference 2009, MSEC2009, pp.593 - 601, ASME, 2009-10-04

44252
Measurement of the Effective Internet Diameter Based on Hop Counts of Effective Connections

김재균, KISS, 1999

44253
Measurement of the Rotor Blade Deformation Using Stereo Cameras and Distributed Fiber Bragg Grating Sensors

Han, Jae-Hung; Kim, H.-I; Park, J.-W, ICAAT 2010 International Conference on Advanced Aircraft Technologies, pp.3 - 5, 2010-08-31

44254
Measurement of the Size of Electrosprayed Droplets Emitted from the Taylor Cone in Vacuum

Ku, BK; Kim, Sang Soo, 19th Annual Conference of the American Association for Aerosol Research (AAAR), The American Association for Aerosol Research(AAAR), 2000-11-06

44255
Measurement of the space-time relation in quantum coherence propagation

Wang, L.J.; Rhee, June-Koo Kevin, International Quantum Electronics Conference, vol. 7, 1998 OSA Technical Digest Series, pp.134 - 135, OSA, 1998-05

44256
Measurement of the Thermal Expansion for Space Structures Using Fiber Bragg Grating Sensors and Displacement Measuring

Kim, H.-I.; Kang, L.-H.; Han, Jae-Hung, ASME Conference on Smart Materials, Adaptive Structures and Intelligent Systems, SMASIS2008, pp.387 - 395, American Society of Mechanical Engineers, 2008-10-30

44257
Measurement of Thermal Deformations of Chip Scale Packages Using Moire Interferometry

Ham, SJ; Hwang, TK; Lee, Soon-Bok, SEMICON Korea Technical Symposium 2001, Serial 14, pp.239 - 244, 2001

44258
Measurement of Thermal Deformations of Electronic packages using Moire Interferometry

Lee, Soon-Bok; Ham, SJ, KSME 2000 Conference of Materials and Frcture Division, pp.314 - 320, 2000

44259
Measurement of Thermal Expansion Coefficient of FR4 Using Digital Image Correlation System for Warpage Prediction of Package Substrate

Lee, TI; Kim, C; Kim, MS; 김택수, 2014 KSPE Fall Meeting, KSPE, 2014-10-29

44260
Measurement of thermal expansion coefficient of poly-si using microgauge sensors

Chae J.-H.; Lee J.-Y.; Kang S.-W., Smart Electronics and MEMS, v.3242, pp.202 - 211, 1997-12-11

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