Browse "College of Engineering(공과대학)" by Type Conference

Showing results 65381 to 65400 of 90952

65381
Studies on anaerobic batch and continuous fermentations of Mannheimia succiniciproducens MBEL55E for succinic acid production

Jung, Y.C.; Choi, B.K.; Song, H.H.; Lee, SangYup; Chang, H.N., The 18th Symposium on Chemical Engineering, Daejeon/Chungnam(Korea)-Kyushu(Japan), The 18th Symposium on Chemical Engineering, Daejeon/Chungnam(Korea)-Kyushu(Japan), 2005-12

65382
Studies on Burnup Credit Criticality Safety for Storage and Transportation of PWR Spent Fuel in Korea

Koh, D.J; Cho, Nam-Zin, The Sixth International Conference on Nuclear Criticality Safety (ICNT'99), v.3, pp.1934 -, 1999-09

65383
Studies on Carbon Dioxide Separation through Membrane Absorber

고준성; 홍정진; 양승만, The 9th Symposium on Chemical Engineering Taejeon/Chungnam-Kyushu, pp.295 - 296, 1996-10-01

65384
Studies on Cd0.96Zn0.04Te/Hg0.78Cd0.22Te MIS structures

Lee, Hee Chul, ACSSI-2002, pp.0 - 0, 2002-11-01

65385
Studies on chiral-enhanced phenomena of biomolecules with silver nanoparticles

Taihua, L; Park, Hyun Gyu, Annual Meeting of Korean Institute of Biotechnology and Bioengineering, 2003

65386
Studies on chiral-enhanced phenomena of biomolecules with silver nanoparticles

Park, Hyun Gyu, Conference on Nanoscale Devices and System Integration(NDSI)--IEEE/NANO-2004, pp.0 - 0, 2004

65387
Studies on cyclic behaviors of the unit bucket for tripod foundation system under various loadings via centrifuge model tests

Jeong, Yeong Hoon; Kim, Dong-Soo; Kim, Jae Hyun; Parkn Hun Jun, Geo-Congress 2019, ASCE, 2019-03-25

65388
Studies on double-layered metal bumps for fine pitch flip chip applications

Son, HY; Yeo, YW; Jung, GJ; Lee, JK; Choi, JY; Park, CJ; Suh, MS; et al, EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging, v.2005, pp.95 - 100, 2005-12-11

65389
Studies on growth of monodispersed silica particles by sol-gel method

양승만, 한국화학공학회 춘계학술발표회, pp.953 - 956, 한국화학공학회, 1998-04-01

65390
Studies on Microvoids at the Interface of Direct Bonded Silicon Wafers

강상원, 제2회 한국진공학회 학술발표회, 1992

65391
Studies on Ni-Sn Intermetallic Compound and P-rich Ni Layer at the Electroless Nickel (NiP)-Solder Interface and Their Effects on Flip Chip Solder Joint Reliability

전영두; 백경욱, 한국 마이크로 전자 및 패키징학회 추계 기술심포지움, pp.67 - 71, 한국 마이크로 전자 및 패키징학회, 2000-11-01

65392
Studies on Ni-Sn intermetallic compound and P-rich Ni layer at the electroless Nickel UBM - Solder interface and their effects on flip chip solder joint reliability

Jeon, YD; Paik, Kyung-Wook; Bok, KS; Choi, WS; Cho, CL, 51st Electronic Components and Technology Conference, pp.1326 - 1332, IEEE, 2001-05-29

65393
Studies on Preparation of Monodispersed Silica Particles using Sol-Gel Method and Rheological Behaviors of Silica Dispersion

양승만, 한국화학공학회 춘계학술발표회, pp.905 - 908, 한국화학공학회, 1996-04-01

65394
Studies On PVA-PVDF Based Solid Polymer Blend Electrolytes

Lee, Jai Young, 6th International Conference on New Energy Systems and Conversions, 2003

65395
Studies on the application of supercritical carbon dioxide cycle to a small modular reactor

Yoon,HJ; Ahn,Y; Lee,JH; Lee, JeongIk, International Congress on Advances in Nuclear Power Plants 2011 (ICAPP 2011), French Nuclear Energy Society, 2011-05

65396
Studies on the Biodegradation of Polyurethanes under Compositing Conditions.

Kim, Sung Chul, Pacific Polymer Conference, 1997

65397
Studies on the dimensional and piezoelectric characteristics of 3D printed piezoelectric structures

KIM, InSup; Yoon, Yong Jin, International Symposium on Precision Engineering and Sustainable Manufacturing, PRESM 2021, 한국정밀공학회, 2021-07-21

65398
Studies on the High Temperatute Superconductor (HTS)/Metal/Polymer Dielectric Interconnect Structure for Packaging Applications

Paik, Kyung-Wook; Mogro-Campero, A; Turner, L, 44th ECTC Proceeding, pp.326 - 336, 1994-03-01

65399
Studies on the interfacial reactions between electroless Ni UBM and 95.5Sn-4.0 Ag-0.5 Cu alloy

Jeon, YD; Nieland, S; Ostmann, A; Reichl, H; Paik, Kyung-Wook, 52nd Electronic Components and Technology Conference, pp.740 - 746, IEEE, 2002-05-28

65400
Studies on the Interfacial Tensions of Liquid Metal-Fluid Systems

류가빈; 김형수, 재 12회 한국유체공학학술대회, 한국전산유체공학회, 2022-06-23

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