Browse "College of Engineering(공과대학)" by Type Conference
Showing results 69981 to 70000 of 90952
| Thermoelectric Characterization of Si/Silicide-Heterostructure Layers Fabricated by RF Magnetron Sputtering 이지화; 하재권; 윤종세; 윤기완, 2017년도 한국재료학회 추계학술대회, 사단법인 한국재료학회, 2017-11-16 |
| Thermoelectric effect of silicide and silicon hetero-junction structured devices Wonchul Choi; Shin, Mincheol, E-MRS 2013 SPRING MEETING, E-MRS, 2013-05-27 |
| Thermoelectric power generation using H2O2 decomposition for portable power source Jin, Jungkun; Kwon, Sejin, PowerMEMS 2008, PowerMEMS, 2008-11-09 |
| Thermoelectric Properties of p-type Sb2Te3 and n-type Bi2Te3 Thick Films Deposited by Screen-Printing Technique Kim, Sun Jin; We, Ju Hyung; Kim, Gyung Soo; Cho, Byung Jin, 2nd ENGE 2012 (Int'l Conference on Electrical Materials and Nanotechnology for Green Environment), The korean Institute of Metals and Materials, 2012-09-19 |
| Thermoelectric Properties of PbTe@C Nanocables Prepared via One-Step Hydrothermal Synthesis Yong, Seok-Min; Kim, Do-Kyung, Asian Thermophysical Properties Conference, 한국열물성학회, 2013-09-29 |
| Thermoelectric properties of silicide/silicon hetero-junction structure Choi, Wonchul; Park, Young Sam; Huyn, Younghoon; Zyung, Taehyoung; Kim, Jaehyun; Kim, Soojung; Hyojin Jeon; et al, ENGE-12, 2012-09-18 |
| Thermoelectric Properties of the Pt silicide/silicon Laminate Structured p-type Devices Choi, Wonchul; Shin, Mincheol, 한국물리학회 2013 가을 학술논문 발표회, 한국물리학회, 2013-10-30 |
| Thermoformable Shell for Repeatable Thermoforming Ko, Donghyeon; Kim, Myeongseong; Lee, Woohun, The 35th Annual ACM Symposium on User Interface Software and Technology, UIST '22, ACM, 2022-10-31 |
| Thermogravimetric Analysis of Metal Oxides for Chemical Looping Hydrogen Generation with Synthsis Gas Kim, Sang Done, 6th Korea-China Workshop on lean Energy Technology, pp.613 - 621, 2006 |
| Thermohydraulic Design Analysis Modeling for Korea Advanced NUclear Thermal Engine Rocket for Space Application 남승현; 최재영; Venneri, Paolo; 정용훈; 장순흥, Korean Nuclear Society Spring Meeting, Korean Nuclear Society, 2015-05-08 |
| Thermomechanical stress analysis of Multilayer PCBs consisting of metals and viscoelastic polymers Paik, Kyung-Wook; Lim, JH; Kim, JS; Earmme, YY, International Conference on Fracture & Strength of Solids 2000, pp.0 - 0, 2000-12-01 |
| Thermomechanical Behavior of Alkali-Activated Concrete under High Temperatures : An Overview Kim, JS; Lee, Haeng-Ki; Park, SM, The 4th International Conference on Computational Design in Engineering (CODE2018), COSEIK, 2018-04-02 |
| Thermomechanical Behavior of PVA fiber Reinforced Alkali-Activated Concrete 김진성; 박솔뫼; 이행기, 한국콘크리트학회 2018 가을 학술대회, 한국콘크리트학회, 2018-11-08 |
| Thermomechanical Behavior of Shape Adaptive Structures with SMA Actuator Lee, In; Roh, J. H.; Yang, S. M.; Han, Jae-Hung, 6th International Congress on Thermal Stress, Vienna University of Technology v. no. , Technische Universitat Wien, 2005-05 |
| Thermomechanical Behaviors of Ni-Ti Shape Memory Alloy Ribbons and Their Numerical Modeling Roh, J. H.; Han, Jae-Hung; Lee, In, International Conference on technology Fusion, Artificial Muscle Research Center, 2006-05 |
| Thermomechanical Fatigue and Heat Generation Bahavior of Filled Rubber Vulcanizates during Cyclic Deformation Park, DM; Hong, Won-Hi; Kim, SG; Kim, HJ, International Rubber Conference 99, pp.699 - 702, 1999-04-01 |
| Thermomechanical fatigue behavior of ferritic stainless steel Lee, Soon-Bok; Lee, Keum-Oh; Hong, Seong-Gu; Yoon, Samson; Kim, Bong-Soo, APCFS(Asian Pacific Conf for Fracture and Strength)'04, pp.190 - 190, 2004 |
| Thermomechanical Fatigue Deformation Approach Using Bi-Linear Model Lee, Soon-Bok; Lee, Keum-Oh, Tokyo Tech-KAIST joint workshop, pp.38 - 39, 2005 |
| Thermomechanical Fatigue of the Ferritic Stainless Steel 429EM Lee, Soon-Bok; Lee, Keum-oh; Yoon, Samson, FEOFS 2003, 2003 |
| Thermomechanical Reliability for Emerging Device Technologies: Implications for ULK Integration, 3-D Structures and Packaging Kim, Taek-Soo; R.H. Dauskardt, 2009 IEEE International Reliability Physics Symposium, IEEE, 2009-04-26 |
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