Browse "College of Engineering(공과대학)" by Type Conference

Showing results 70321 to 70340 of 91054

70321
Throttling effects on dual-fuel premixed charge compression ignition under low load condition in a heavy duty diesel engine

Shim, Euijoon; Park, Hyunwook; Bae, Choongsik, 11th Asia-Pacific Conference on Combustion, ASPACC 2017, Combustion Institute, 2017-12

70322
Through silicon via (TSV) equalizer

Kim, Joungho; Song, E.; Cho, J.; Pak, J.S.; Lee, J.; Lee, H.; Kim, J., 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09, pp.13 - 16, 123, 2009-10-19

70323
Through Silicon Via (TSV) Noise Coupling Effects on RF LC-VCO in 3D IC

Kim, Joung-Ho; Lim,Jaemin; Cho,Jonghyun; Lee,Manho; Jung,Danial H; Choi,sumin; Lee,Hyunsuk, 23rd Conference on Electrical Performance of Electronic Packaging and Systems, 23rd Conference on Electrical Performance of Electronic Packaging and Systems, 2014-10-26

70324
Through Silicon Via (TSV) shielding structures

Cho, J.; Kim, Joungho; Song, T.; Pak, J.S.; Kim, J.; Lee, H.; Lee, J.; et al, 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010, pp.269 - 272, IEEE, 2010-10-25

70325
Through silicon via time domain crosstalk modeling considering hysteretic coupling capacitance

Piersanti, S; De Paulis, F; Orlandi, A; Kim, Dong-Hyun; Cho, Jong-Hyun; Kim, Joungho, IEEE International Symposium on Electromagnetic Compatibility, EMC 2015, pp.567 - 572, Institute of Electrical and Electronics Engineers Inc., 2015-08

70326
Through the time tunnel

Lee, Miseong; Nam, Tek-Jin, ACM SIGGRAPH 2008, 2008

70327
Through-Silicon Via (TSV) Depletion Effect

Cho, Jonghyun; Kim, Myunghoi; Kim, Joohee; Pak, Jun So; Kim, Joungho; Lee, Hyungdong; Lee, Junho; et al, 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEP 2011, 2011-10-24

70328
Throughflow analysis by Newton-Raphson method for axial flow gas turbines

Kim, J.H.; Kim, H.M.; No, Hee Cheon, American Nuclear Society - International Congress on Advances in Nuclear Power Plants 2005, ICAPP'05, v.3, pp.1808 - 1813, 2005-05-15

70329
Throughflow Analysis by Newton-raphson Method for Axial Flow Gas Turbines

No, Hee Cheon; Kim, Ji Hwan; Kim, Hyeun Min, 한국원자력학회 추계발표회, 한국원자력학회, 2004

70330
Throughhand: 2d tactile interaction to simultaneously recognize and touch multiple objects

Jung, Jingun; Son, Sunmin; Lee, Sangyoon; Kim, Yeonsu; Lee, Geehyuk, 2021 CHI Conference on Human Factors in Computing Systems: Making Waves, Combining Strengths, CHI 2021, pp.1 - 13, Association for Computing Machinery, 2021-05-08

70331
Throughput analysis of 1x EV-DO system with multi cells

Choi, Wan; Choi, D.; Lee, J.; Lee, S., IEICE International Technical Conference on Circuit/Systems, Computer, and Communications (ITC-CSCC), pp.1924 - 1927, ITC-CSCC, 2002-07-16

70332
Throughput analysis of a DS/SSMA unslotted ALOHA system with two user classes

So, Jae Woo; Cho, Dong-Ho, International Conference on Communications (ICC2001), pp.1985 - 1989, IEEE, 2001-06-11

70333
Throughput analysis of IEEE 802.11e wireless LANs and efficient Block Ack mechanism

Lee I.-G.; Yoon S.-R.; Park, Sin Chong, IEEE International Symposium on Communications and Information Technologies: Smart Info-Media Systems, ISCIT 2004, v.1, pp.290 - 295, 2004-10-26

70334
Throughput Analysis of Tree-based Protocols for Many-to-many Reliable Multicast

Yoon, W; Lee, DongMan; Youn, HY; Koh, SJ, ICC 2002, pp.2523 - 2527, 2002-04

70335
Throughput and Delay performance of Dynamic Spectrum Management over DSL Arrivals

Yi, Yung; Tsiaflakis, Paschalis; Chiang, Mung; Moonen, Marc, IEEE Globecom, IEEE, 2008-11

70336
Throughput Comparisons of Single- and Two-Hop Celluar Systems with Single or Multiple Antennas

Sung, Dan Keun; Yoon, S.H.; Baek, S.Y.; Ban, T.W., JCCI 2009, 2009-04

70337
Throughput enhancement for short packets in the wireless packet networks

Kwon, Y.-H.; Oh, M.-K.; Park, Dong-Jo, 2004 7th International Conference on Signal Processing Proceedings (ICSP'04), v.3, pp.1833 - 1836, 2004-08-31

70338
Throughput Enhancement of IEEE 802.11 MAC by antenna selection for IEEE 802.11a devices

Lee J.-H.; Lee S.; Park, Sin Chong, 9th International Conference on Advanced Communication Technology, ICACT 2007, v.3, pp.1732 - 1733, 2007-02-12

70339
Throughput Enhancement of Secondary Transmitter under Target Physical Layer Security Rate

Koh, Jeongwan; Myung, Jungho; Kang, Joonhyuk, 24th Annual IEEE International Symposium on Personal, Indoor and Mobile Radio Communications, pp.513 - 517, IEEE, 2013-09-09

70340
Throughput enhancement through arranged power-saving mechanism in wireless LAN

Hyu-dae Kim; Cho, Dong-Ho, 2006 IEEE International Conference on Communications, ICC 2006, pp.4780 - 4785, IEEE, 2006-07-11

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