Browse "College of Engineering(공과대학)" by Type Article
Showing results 36581 to 36600 of 62350
| Numerical Analysis of Microplasma Generated in the Plasma Display Pixel With an Auxiliary Electrode Kim, Eun Sung; Choi, Kyung Cheol, IEEE TRANSACTIONS ON PLASMA SCIENCE, v.39, no.6, pp.1500 - 1506, 2011-06 |
| Numerical analysis of near and far fields scattered by two plates with finite thickness Ih, KD; Lee, Duck-Joo, JOURNAL OF SOUND AND VIBRATION, v.192, no.2, pp.535 - 548, 1996-05 |
| Numerical analysis of offshore monopile during repetitive lateral loading Chong, Song-Hun; Shin, Ho-Sung; Cho, Gye-Chun, GEOMECHANICS AND ENGINEERING, v.19, no.1, pp.79 - 91, 2019-09 |
| Numerical Analysis of Plasma in CO2 Laser and Arc Hybrid Welding Cho, Young Tae; Na, Suck-Joo, INTERNATIONAL JOURNAL OF PRECISION ENGINEERING AND MANUFACTURING, v.16, no.4, pp.787 - 795, 2015-04 |
| Numerical Analysis of Quasi-Steady-Combustion Characteristics in a Solid Rocket Motor Lee, Sung-Nam; Baek, Seung-Wook; Kim, Kyung-Moo, JOURNAL OF PROPULSION AND POWER, v.26, pp.980 - 986, 2010-09 |
| Numerical Analysis of SMA Hybrid Composite Plate Subjected to Low-Velocity Impact Kim, Eun-Ho; Roh, Jin-Ho; Lee, In, KSAS INTERNATIONAL JOURNAL, v.8, no.2, pp.76 - 81, 2007-11 |
| Numerical analysis of the arc in pulsed current gas tungsten arc welding using a boundary-fitted coordinate Fan, H.G.; Shi, Y.W.; Na, Suck-Joo, JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, v.72, no.3, pp.437 - 445, 1997-12 |
| Numerical analysis of the coupling between heat transfer and pyrolysis in heat-not-burn tobacco using computational fluid dynamics Kim, Shin Hyuk; Choi, Hongbum; Jung, Yongmi; Lee, Jay H., KOREAN JOURNAL OF CHEMICAL ENGINEERING, v.39, no.11, pp.2907 - 2915, 2022-11 |
| Numerical analysis of the damage behavior of an aluminum/CFRP hybrid beam under three point bending Shin, Dong Kil; Kim, Hee Chul; Lee, Jungju, COMPOSITES PART B-ENGINEERING, v.56, pp.397 - 407, 2014-01 |
| Numerical analysis of the early age behavior of concrete structures with a hydration based microplane model Lee, Y; Kim, Jin-Keun, COMPUTERS & STRUCTURES, v.87, pp.1085 - 1101, 2009-09 |
| Numerical Analysis of the Heat and Mass Transfer Characteristics in an Autothermal Methane Reformer Park, Joon-Guen; Lee, Shin-Ku; Kim, Sun-Young; Bae, Joong-Myeon, JOURNAL OF FUEL CELL SCIENCE AND TECHNOLOGY, v.7, no.5, 2010-10 |
| Numerical Analysis of the Thermal Performance of a PCM-Based Heat Sink Under Flight Random Vibration Lee, Hojun; Han, Jae-Hung, INTERNATIONAL JOURNAL OF AERONAUTICAL AND SPACE SCIENCES, v.24, no.2, pp.438 - 448, 2023-04 |
| Numerical analysis of the three-dimensional blood flow in the Korean artificial heart Shim, EB; Yeo, JY; Ko, HJ; Youn, ChanHyun; Lee, YR; Park, CY; Min, BG; et al, ARTIFICIAL ORGANS, v.27, pp.49 - 60, 2003-01 |
| Numerical analysis of thermal striping induced high cycle thermal fatigue in a mixing tee Lee, JeongIk; Hu, Lin-wen; Saha, Pradip; Kazimi, Mujid S., NUCLEAR ENGINEERING AND DESIGN, v.239, no.5, pp.833 - 839, 2009-05 |
| Numerical analysis of three-dimensional Bjork-Shiley valvular flow in an aorta Shim, EB; Chang, Keun Sick, JOURNAL OF BIOMECHANICAL ENGINEERING-TRANSACTIONS OF THE ASME, v.119, no.1, pp.45 - 51, 1997-02 |
| Numerical analysis of three-dimensional extrusion of arbitrarily shaped sections by the method of weighted residuals Lee, CM; Yang, Dong-Yol; Kim, MU, INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES, v.32, no.1, pp.65 - 82, 1990 |
| Numerical analysis of three-dimensional extrusion of elliptic sections by the method of weighted residuals Lee, CM; Yang, Dong-Yol; Lange, K, INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES, v.31, no.5, pp.379 - 393, 1989 |
| Numerical Analysis of Time-Dependent Behavior of Pre-cast Pre-stressed Concrete Girder Bridges Kwak, Hyo-Gyoung; Seo, Young-Jae, CONSTRUCTION AND BUILDING MATERIALS, v.16, no.1, pp.49 - 63, 2002-02 |
| NUMERICAL ANALYSIS ON MAGNETIC-ELASTO-PLASTIC BUCKLING AND BENDING OF FERROMAGNETIC RECTANGULAR PLATE Gao, Yuanwen; Huh, Hoon, INTERNATIONAL JOURNAL OF MODERN PHYSICS B, v.22, no.31-32, pp.6212 - 6217, 2008-12 |
| Numerical Analysis on the Die Pad/Epoxy Molding Compound(EMC) Interface Delaminationin Plastic Packages under Thermal and Vapor Pressure Holding 박영배; 유진, 마이크로전자 및 패키징학회지, v.5, no.2, pp.37 - 48, 1998-12 |
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- 23,079 2020 - 2024
- 75,364 2010 - 2019
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