Effects of Plating Condition on the Growth of Cu-Sn Intermetallci Compound of Sn-Pb Electrodeposits on Cu Bases-Leadframe Alloy구리계리드츠레임에 전착된 Sn- Pb 합금 도금층의 금속간화합물 성장에 미치는 도금조건의 영향
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 서민석 | ko |
| dc.contributor.author | 권혁상 | ko |
| dc.date.accessioned | 2013-02-27T17:39:32Z | - |
| dc.date.available | 2013-02-27T17:39:32Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 1995-03 | - |
| dc.identifier.citation | 한국표면공학회지, v.24, pp.33 - 45 | - |
| dc.identifier.issn | 1225-8024 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/69888 | - |
| dc.language | Korean | - |
| dc.publisher | 한국표면공학회 | - |
| dc.title | Effects of Plating Condition on the Growth of Cu-Sn Intermetallci Compound of Sn-Pb Electrodeposits on Cu Bases-Leadframe Alloy | - |
| dc.title.alternative | 구리계리드츠레임에 전착된 Sn- Pb 합금 도금층의 금속간화합물 성장에 미치는 도금조건의 영향 | - |
| dc.type | Article | - |
| dc.type.rims | ART | - |
| dc.citation.volume | 24 | - |
| dc.citation.beginningpage | 33 | - |
| dc.citation.endingpage | 45 | - |
| dc.citation.publicationname | 한국표면공학회지 | - |
| dc.contributor.localauthor | 권혁상 | - |
| dc.contributor.nonIdAuthor | 서민석 | - |
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