DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kim, SS | ko |
dc.contributor.author | Chang, Choong-Seock | ko |
dc.contributor.author | Yoon, NS | ko |
dc.date.accessioned | 2013-02-27T14:21:38Z | - |
dc.date.available | 2013-02-27T14:21:38Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 1996-10 | - |
dc.identifier.citation | JOURNAL OF THE KOREAN PHYSICAL SOCIETY, v.29, no.5, pp.678 - 681 | - |
dc.identifier.issn | 0374-4884 | - |
dc.identifier.uri | http://hdl.handle.net/10203/69055 | - |
dc.description.abstract | We present a one-dimensional model for a transformer-coupled plasma (TCP) discharge, which includes both the collisional and the collisionless heating mechanisms. We investigate the one-dimensional heating and the transport properties of a TCP discharge in a self-consistent manner. It is found that a critical behavior in power coupling appears as the reactor length is changed. Thus, it is concluded that the reactor length should be larger than a critical length to obtain a sufficient power. | - |
dc.language | English | - |
dc.publisher | KOREAN PHYSICAL SOC | - |
dc.subject | COUPLED DISCHARGE | - |
dc.subject | INDUCTION PLASMA | - |
dc.subject | FLUID MODEL | - |
dc.subject | SIMULATION | - |
dc.title | A one-dimensional model for a TCP discharge including the collisionless electron heating mechanism | - |
dc.type | Article | - |
dc.identifier.wosid | A1996VM66300023 | - |
dc.type.rims | ART | - |
dc.citation.volume | 29 | - |
dc.citation.issue | 5 | - |
dc.citation.beginningpage | 678 | - |
dc.citation.endingpage | 681 | - |
dc.citation.publicationname | JOURNAL OF THE KOREAN PHYSICAL SOCIETY | - |
dc.contributor.localauthor | Chang, Choong-Seock | - |
dc.contributor.nonIdAuthor | Kim, SS | - |
dc.contributor.nonIdAuthor | Yoon, NS | - |
dc.type.journalArticle | Article | - |
dc.subject.keywordPlus | COUPLED DISCHARGE | - |
dc.subject.keywordPlus | INDUCTION PLASMA | - |
dc.subject.keywordPlus | FLUID MODEL | - |
dc.subject.keywordPlus | SIMULATION | - |
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