Numerical Analysis on the Die Pad/Epoxy Molding Compound(EMC) Interface Delaminationin Plastic Packages under Thermal and Vapor Pressure Holding
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 박영배 | ko |
| dc.contributor.author | 유진 | ko |
| dc.date.accessioned | 2013-02-27T11:48:13Z | - |
| dc.date.available | 2013-02-27T11:48:13Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 1998-12 | - |
| dc.identifier.citation | 마이크로전자 및 패키징학회지, v.5, no.2, pp.37 - 48 | - |
| dc.identifier.issn | 1226-9360 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/68365 | - |
| dc.language | English | - |
| dc.publisher | 한국마이크로전자및패키징학회 | - |
| dc.title | Numerical Analysis on the Die Pad/Epoxy Molding Compound(EMC) Interface Delaminationin Plastic Packages under Thermal and Vapor Pressure Holding | - |
| dc.type | Article | - |
| dc.type.rims | ART | - |
| dc.citation.volume | 5 | - |
| dc.citation.issue | 2 | - |
| dc.citation.beginningpage | 37 | - |
| dc.citation.endingpage | 48 | - |
| dc.citation.publicationname | 마이크로전자 및 패키징학회지 | - |
| dc.contributor.localauthor | 유진 | - |
| dc.contributor.nonIdAuthor | 박영배 | - |
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