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College of Engineering(공과대학)School of Electrical Engineering(전기및전자공학부)EE-Conference Papers(학술회의논문)

Reduction of cavity-to-cavity power/ground noise coupling through plane cutout in multi-layer PCBs

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dc.contributor.authorLee, J.ko
dc.contributor.authorKim, M.ko
dc.contributor.authorKim, Jounghoko
dc.contributor.authorRotaru, M.D.ko
dc.contributor.authorIyer, M.K.ko
dc.date.accessioned2007-06-27T05:17:20Z-
dc.date.available2007-06-27T05:17:20Z-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.issued2004-08-09-
dc.identifier.citation2004 IEEE International Symposium on Electromagnetic Compatibility, EMC 2004, pp.35 - 38-
dc.identifier.issn1077-4076-
dc.identifier.urihttp://hdl.handle.net/10203/680-
dc.languageEnglish-
dc.language.isoen_USen
dc.publisherIEEE-
dc.titleReduction of cavity-to-cavity power/ground noise coupling through plane cutout in multi-layer PCBs-
dc.typeConference-
dc.identifier.wosid000223620100008-
dc.identifier.scopusid2-s2.0-4644243604-
dc.type.rimsCONF-
dc.citation.beginningpage35-
dc.citation.endingpage38-
dc.citation.publicationname2004 IEEE International Symposium on Electromagnetic Compatibility, EMC 2004-
dc.identifier.conferencecountryUS-
dc.identifier.conferencelocationSanta Clara, CA-
dc.embargo.liftdate9999-12-31-
dc.embargo.terms9999-12-31-
dc.contributor.localauthorKim, Joungho-
dc.contributor.nonIdAuthorLee, J.-
dc.contributor.nonIdAuthorKim, M.-
dc.contributor.nonIdAuthorRotaru, M.D.-
dc.contributor.nonIdAuthorIyer, M.K.-
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