DC Field | Value | Language |
---|---|---|
dc.contributor.author | 정태경 | ko |
dc.contributor.author | 김영호 | ko |
dc.contributor.author | 유진 | ko |
dc.date.accessioned | 2013-02-27T07:28:12Z | - |
dc.date.available | 2013-02-27T07:28:12Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 1993-04 | - |
dc.identifier.citation | 한국표면공학회지, v.26, no.2, pp.71 - 81 | - |
dc.identifier.issn | 1225-8024 | - |
dc.identifier.uri | http://hdl.handle.net/10203/67253 | - |
dc.description.abstract | Thed effects of Ar or Oxygen RF plasma treatment on the adhesion behavior of Cr films to polyimide sub-strates have been investigated by using SEM, XRD, AES, and 90°peel test. By applying RF plasma treatment of the polyimide surface prior to metal deposition, the peel adhesion strength of Cu/Cr films sputtered onto the fully cured BPDA-PDA polyimide was highly increased from about 3g/mm to 90 ~ 100g/mm. Improved peel adhesion strength of Cr/polyimide interfaces due to RF plasma treatment was attributed to the contributions from surface cleaning, Cr-polyimide bonding at the interface, and force required for plastic deformation of the film. While the surface topology change of the polyimide caused by RF plasma treatment makes a little contri-bution to the improved adhesion. | - |
dc.language | Korean | - |
dc.publisher | 한국표면공학회 | - |
dc.title | 크롬/폴리이미드의 접착력에 미치는 폴리이미드 표면의 플라즈마 처리 효과 | - |
dc.title.alternative | The effects of plasma treatment of polyimide surface on the adhesion of chromium/polyimide | - |
dc.type | Article | - |
dc.type.rims | ART | - |
dc.citation.volume | 26 | - |
dc.citation.issue | 2 | - |
dc.citation.beginningpage | 71 | - |
dc.citation.endingpage | 81 | - |
dc.citation.publicationname | 한국표면공학회지 | - |
dc.contributor.localauthor | 유진 | - |
dc.contributor.nonIdAuthor | 정태경 | - |
dc.contributor.nonIdAuthor | 김영호 | - |
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