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NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
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Design and evaluation for mechanical strength of an anodically bonded pressurized cavity array for wafer-level MEMS packaging Doh, Il; Cho, Young-Ho, SENSORS AND MATERIALS, v.18, no.5, pp.231 - 240, 2006 | |
Fabrication and characterization of a low-temperature hermetic MEMS package bonded by a closed-loop AuSn solder line Kim, Seong-A; Seo, Young Ho; Cho, Young-Ho; Kim, Geunho; Bu, Jong-Uk, SENSORS AND MATERIALS, v.18, no.4, pp.199 - 213, 2006 |
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