Browse "BiS-Journal Papers(저널논문)" by Subject hermetic MEMS packaging

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Fabrication and characterization of a low-temperature hermetic MEMS package bonded by a closed-loop AuSn solder line

Kim, Seong-A; Seo, Young Ho; Cho, Young-Ho; Kim, Geunho; Bu, Jong-Uk, SENSORS AND MATERIALS, v.18, no.4, pp.199 - 213, 2006

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