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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Fatigue and fracture assessment for reliability in electronics packaging Lee, Soon-Bok; Kim, I; Park, TS, INTERNATIONAL JOURNAL OF FRACTURE, v.150, pp.91 - 104, 2008-03 | |
| Effects of the colony size on the fracture toughness of TiAl-Mo-B alloys Kim, Seung-Woo; Kim, JS; Kumar, KS; Wee, Dang-Moon; Oh, MH, METALS AND MATERIALS INTERNATIONAL, v.14, no.1, pp.41 - 45, 2008-02 | |
| A new energy-based fatigue damage parameter in life prediction of high-temperature structural materials Lee, Keum-Oh; Hong, Seong-Gu; Lee, Soon-Bok, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.496, no.1-2, pp.471 - 477, 2008-11 | |
| Nanoparticle generation using corona discharge ions from a supersonic flow in low pressure Jung, Jae Hee; Kim, Sang Bok; Kim, Sang Soo, POWDER TECHNOLOGY, v.185, no.1, pp.58 - 66, 2008-06 | |
| Development of a NiTi actuator using a two-way shape memory effect induced by compressive loading cycles Kim, Hyun-Chul; Yoo, Young-Ik; Lee, Jungju, SENSORS AND ACTUATORS A-PHYSICAL, v.148, no.2, pp.437 - 442, 2008-12 |