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Results 1-2 of 2 (Search time: 0.008 seconds).

NO	Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)
1	Direct reproduction of 3D microstructures using a hybrid approach; by creation of master-patterns and metallic molds for embossing Bae, Kong Myeong; Ko, Jong Soo; Lim, Tae Woo; Yang, Dong-Yol; Shin, Bo Sung; Lee, Hee Soo; Park, Sang Hu, MICROELECTRONIC ENGINEERING, v.88, no.11, pp.3300 - 3305, 2011-11
2	Adaptive bonding technique for precise assembly of three-dimensional microstructures Park, SH; Jeong, JH; Choi, DG; Kim, KD; Altun, AO; Lee, ES; Yang, Dong-Yol; Lee, KS, APPLIED PHYSICS LETTERS, v.90, no.23, pp.6883 - 6888, 2007-06

Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)

Direct reproduction of 3D microstructures using a hybrid approach; by creation of master-patterns and metallic molds for embossing

Bae, Kong Myeong; Ko, Jong Soo; Lim, Tae Woo; Yang, Dong-Yol; Shin, Bo Sung; Lee, Hee Soo; Park, Sang Hu, MICROELECTRONIC ENGINEERING, v.88, no.11, pp.3300 - 3305, 2011-11

Adaptive bonding technique for precise assembly of three-dimensional microstructures

Park, SH; Jeong, JH; Choi, DG; Kim, KD; Altun, AO; Lee, ES; Yang, Dong-Yol; Lee, KS, APPLIED PHYSICS LETTERS, v.90, no.23, pp.6883 - 6888, 2007-06

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