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Results 1-10 of 133 (Search time: 0.01 seconds).

NO Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)
1
Competing damage mechanisms in the thermo-mechanical fatigue of AISI 304L stainless steel

Bae, Keun-Ho; Kim, Hyun-Ho; Lee, Soon-Bok, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.529, pp.417 - 424, 2011-11

2
Mechanical Fatigue Testings of BGA Type Solder Joints

Ham, Suk-Jin; Lee, Soon-Bok, EXPERIMENTAL MECHANICS, 2006

3
A study on the thermal fatigue behavior of solder joints under power cycling conditions

Yang, Se Young; Kim, Ilho; Lee, Soon-Bok, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.31, no.1, pp.3 - 12, 2008-03

4
Development of a tri-axial load cell based on strain gages

Kim, JH; Lee, KW; Lee, Soon-Bok; Earmme, YY, EXPERIMENTAL TECHNIQUES, v.25, no.1, pp.30 - 34, 2001

5
Fatigue crack growth behaviour of SM45C steel under mixed-mode I and II loading

You, BR; Lee, Soon-Bok, FATIGUE FRACTURE OF ENGINEERING MATERIALS STRUCTURES, v.21, no.9, pp.1037 - 1048, 1998-09

6
In-Plane Deformation Measurement of Thin Packages Using an Atomic Force Microscope Moire Method With a Pseudo-Phase-Shifting Technique

Jang, Jae-Won; Park, Jin-Hyoung; Lee, Soon-Bok, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.2, no.12, pp.1992 - 2000, 2012-12

7
Modeling of materials behavior at various temperatures of hot isostatically pressed superalloys

Lee, Keum-Oh; Lee, Soon-Bok, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.541, pp.81 - 87, 2012-04

8
Effect of a brazing process on mechanical and fatigue behavior of alclad aluminum 3005

Kim, Hyun-Ho; Lee, Soon-Bok, JOURNAL OF MECHANICAL SCIENCE AND TECHNOLOGY, v.26, no.7, pp.2111 - 2115, 2012-07

9
A study on thermal cycling (T/C) reliability of anisotropic conductive film (ACF) flip chip assembly for thin chip-on-board (COB) packages

Jang, Kyung-Woon; Park, Jin-Hyoung; Lee, Soon-Bok; Paik, Kyung-Wook, MICROELECTRONICS RELIABILITY, v.52, no.6, pp.1174 - 1181, 2012-06

10
Fatigue crack opening stress based on the strip-yield model

Kim, JH; Lee, Soon-Bok, THEORETICAL AND APPLIED FRACTURE MECHANICS, v.34, no.1, pp.73 - 84, 2000-08

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