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NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
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A comparative study of the fatigue Behavior of SnAgCu and SnPb solder joints Kim, IH; Park, TS; Yang, SY; Lee, Soon-Bok, ADVANCES IN FRACTURE AND STRENGTH, PTS 1- 4, v.297-300, pp.831 - 836, 2005 |
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