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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Thermally stable and soft pressure-sensitive adhesive for foldable electronics Jo, Woosung; Jeong, Kihoon; Park, Young-Sam; Lee, Jeong-Ik; Im, Sung Gap; Kim, Taek-Soo, CHEMICAL ENGINEERING JOURNAL, v.452, 2023-01 | |
| A modulus-engineered multi-layer polymer film with mechanical robustness for the application to highly deformable substrate platform in stretchable electronics Kim, Youson; Kim, Junmo; kim, chanyoung; Kim, Taehyun; Lee, Chungryeol; Jeong, Kihoon; Jo, Woosung; Yoo, Seunghyup; Kim, Taek-Soo; Choi, Kyung Cheol; Im, Sung Gap, CHEMICAL ENGINEERING JOURNAL, v.431, no.2, 2022-03 | |
| A hyperelastic adhesive forming multiple neutral planes even at extreme temperatures Jeong, Kihoon; Kim, Dohun; AHN, DAHYE; Yang, Chanhee; Kim, Junmo; Lee, ChangHyeon; Kim, Youson; LEE, CHUNGRYEOL; Park, Young-Sam; Lee, Seung-Hyun; Kim, Taek-Soo; Im, Sung Gap, CHEMICAL ENGINEERING JOURNAL, v.480, 2024-01 |
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