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NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
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Fatigue and fracture assessment for reliability in electronics packaging Lee, Soon-Bok; Kim, I; Park, TS, INTERNATIONAL JOURNAL OF FRACTURE, v.150, pp.91 - 104, 2008-03 | |
Low-cycle fatigue characteristics of Sn-based solder joints Lee, KO; Yu, Jin; Park, TS; Lee, Soon-Bok, JOURNAL OF ELECTRONIC MATERIALS, v.33, no.4, pp.249 - 257, 2004-04 |
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