Results 1-3 of 3 (Search time: 0.008 seconds).
NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
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A study on the thermal fatigue behavior of solder joints under power cycling conditions Yang, Se Young; Kim, Ilho; Lee, Soon-Bok, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.31, no.1, pp.3 - 12, 2008-03 | |
Fatigue and fracture assessment for reliability in electronics packaging Lee, Soon-Bok; Kim, I; Park, TS, INTERNATIONAL JOURNAL OF FRACTURE, v.150, pp.91 - 104, 2008-03 | |
A new energy-based fatigue damage parameter in life prediction of high-temperature structural materials Lee, Keum-Oh; Hong, Seong-Gu; Lee, Soon-Bok, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.496, no.1-2, pp.471 - 477, 2008-11 |