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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| A study on thermal cycling (T/C) reliability of anisotropic conductive film (ACF) flip chip assembly for thin chip-on-board (COB) packages Jang, Kyung-Woon; Park, Jin-Hyoung; Lee, Soon-Bok; Paik, Kyung-Wook, MICROELECTRONICS RELIABILITY, v.52, no.6, pp.1174 - 1181, 2012-06 | |
| Comparison of prediction methods for low-cycle fatigue life of HIP superalloys at elevated temperatures for turbopump reliability Lee, Keum-Oh; Bae, Keun-Ho; Lee, Soon-Bok, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.519, no.1-2, pp.112 - 120, 2009-08 |
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