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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Mechanical Fatigue Testings of BGA Type Solder Joints Ham, Suk-Jin; Lee, Soon-Bok, EXPERIMENTAL MECHANICS, 2006 | |
| A study on the thermal fatigue behavior of solder joints under power cycling conditions Yang, Se Young; Kim, Ilho; Lee, Soon-Bok, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.31, no.1, pp.3 - 12, 2008-03 | |
| Development of a tri-axial load cell based on strain gages Kim, JH; Lee, KW; Lee, Soon-Bok; Earmme, YY, EXPERIMENTAL TECHNIQUES, v.25, no.1, pp.30 - 34, 2001 | |
| Fatigue crack opening stress based on the strip-yield model Kim, JH; Lee, Soon-Bok, THEORETICAL AND APPLIED FRACTURE MECHANICS, v.34, no.1, pp.73 - 84, 2000-08 | |
| A comparative study of the fatigue Behavior of SnAgCu and SnPb solder joints Kim, IH; Park, TS; Yang, SY; Lee, Soon-Bok, ADVANCES IN FRACTURE AND STRENGTH, PTS 1- 4, v.297-300, pp.831 - 836, 2005 | |
| Characterization of Deformation Behaviors and Elastic Moduli of Multilayered Films in Piezoelectric Inkjet Head Hong, Seong-Gu; Kirn, Minho; Lee, Soon-Bok; Lee, Chong Soo, JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, v.17, pp.1155 - 1163, 2008-10 | |
| Fatigue and fracture assessment for reliability in electronics packaging Lee, Soon-Bok; Kim, I; Park, TS, INTERNATIONAL JOURNAL OF FRACTURE, v.150, pp.91 - 104, 2008-03 | |
| Health monitoring for electronic package using a simple Moire interferometry PARK Jin-Hyoung; Lee, Soon-Bok, JOURNAL OF SOLID MECHANICS AND MATERIALS ENGINEERING, v.2, no.6, pp.822 - 830, 2008 | |
| Prediction of crack opening stress for part-through cracks and its verification using a modified strip-yield model Kim, JH; Lee, Soon-Bok, ENGINEERING FRACTURE MECHANICS, v.66, no.1, pp.1 - 14, 2000-05 | |
| Stochastic modelling of low-cycle fatigue damage in 316L stainless steel under variable multiaxial loading Lee, BH; Lee, Soon-Bok, FATIGUE FRACTURE OF ENGINEERING MATERIALS STRUCTURES, v.23, no.12, pp.1007 - 1018, 2000-12 |
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