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NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
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Reduction of fabricational thermal residual stress of the hybrid co-cured structure using a dielectrometry Kim, HS; Lee, Dai Gil, COMPOSITES SCIENCE AND TECHNOLOGY, v.67, pp.29 - 44, 2007-01 | |
Effects of applied pressure and temperature during curing operation on the strength of tubular single-lap adhesive joints Kim, JK; Lee, Dai Gil, JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.18, no.1, pp.87 - 107, 2004 | |
Repair of underground buried pipes with resin transfer molding Lee, Dai Gil; Chin, WS; Kwon, JW; Yoo, AK, COMPOSITE STRUCTURES, v.57, no.1-4, pp.67 - 77, 2002-07 |
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