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Results 1-2 of 2 (Search time: 0.004 seconds).

NO Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)
1
In situ cure monitoring of adhesively bonded joints by dielectrometry

Kwon, JW; Chin, WS; Lee, Dai Gil, JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.17, pp.2111 - 2130, 2003

2
Dielectric cure monitoring for glass/polyester prepreg composites

Kim, HG; Lee, Dai Gil, COMPOSITE STRUCTURES, v.57, no.1-4, pp.91 - 99, 2002-07

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