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NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
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Effects of applied pressure and temperature during curing operation on the strength of tubular single-lap adhesive joints Kim, JK; Lee, Dai Gil, JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.18, no.1, pp.87 - 107, 2004 | |
Non-isothermal in situ dielectric cure monitoring for thermosetting matrix composites Lee, Dai Gil; Kim, HG, JOURNAL OF COMPOSITE MATERIALS, v.38, no.12, pp.977 - 993, 2004 |
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