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NO	Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)
1	Prediction of crack length and crack growth rate of adhesive joints by a piezoelectric method Hwang, HY; Kim, BJ; Chin, WS; Kim, HS; Lee, Dai Gil, JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.19, no.12, pp.1081 - 1111, 2005
2	Adhesion characteristics of carbon/epoxy composites treated with low- and atmospheric pressure plasmas Kim, JK; Kim, HS; Lee, Dai Gil, JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.17, no.13, pp.1751 - 1771, 2003
3	Investigation of optimal surface treatments for carbon/epoxy composite adhesive joints Kim, JK; Kim, HS; Lee, Dai Gil, JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.17, no.3, pp.329 - 352, 2003

Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)

Hwang, HY; Kim, BJ; Chin, WS; Kim, HS; Lee, Dai Gil, JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.19, no.12, pp.1081 - 1111, 2005

Kim, JK; Kim, HS; Lee, Dai Gil, JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.17, no.13, pp.1751 - 1771, 2003

Kim, JK; Kim, HS; Lee, Dai Gil, JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.17, no.3, pp.329 - 352, 2003

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