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NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
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Prediction of crack length and crack growth rate of adhesive joints by a piezoelectric method Hwang, HY; Kim, BJ; Chin, WS; Kim, HS; Lee, Dai Gil, JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.19, no.12, pp.1081 - 1111, 2005 | |
Adhesion characteristics of carbon/epoxy composites treated with low- and atmospheric pressure plasmas Kim, JK; Kim, HS; Lee, Dai Gil, JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.17, no.13, pp.1751 - 1771, 2003 | |
Investigation of optimal surface treatments for carbon/epoxy composite adhesive joints Kim, JK; Kim, HS; Lee, Dai Gil, JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.17, no.3, pp.329 - 352, 2003 |
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