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Results 11-12 of 12 (Search time: 0.004 seconds).
| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| In situ cure monitoring of adhesively bonded joints by dielectrometry Kwon, JW; Chin, WS; Lee, Dai Gil, JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.17, pp.2111 - 2130, 2003 | |
| Repair of underground buried pipes with resin transfer molding Lee, Dai Gil; Chin, WS; Kwon, JW; Yoo, AK, COMPOSITE STRUCTURES, v.57, no.1-4, pp.67 - 77, 2002-07 |
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