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Results 1-3 of 3 (Search time: 0.006 seconds).

NO Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)
1
Piezoelectric monitoring of the reliability of adhesive joints

Kwon, JW; Chin, WS; Lee, Dai Gil, JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.17, no.6, pp.777 - 796, 2003

2
Trenchless repairing of underground pipes using RTM based on the axiomatic design method

Chin, WS; Kwon, JW; Lee, Dai Gil, JOURNAL OF COMPOSITE MATERIALS, v.37, no.12, pp.1109 - 1126, 2003

3
In situ cure monitoring of adhesively bonded joints by dielectrometry

Kwon, JW; Chin, WS; Lee, Dai Gil, JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.17, pp.2111 - 2130, 2003

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