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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| High-Performance, Solution-Processed, Embedded Multiscale Metallic Transparent Conductors Oh, Yong Suk; Lee, Hyunwoo; Choi, Dong Yun; Lee, Sung-Uk; Kim, Hojin; Yoo, Seunghyup; Park, Inkyu; Sung, Hyung Jin, ACS APPLIED MATERIALS & INTERFACES, v.8, no.17, pp.10937 - 10945, 2016-05 | |
| Structural and electrochemical properties of interconnect integrated solid oxide fuel cell Baek, Seung-Wook; Jeong, Jihoon; Choi, Won Seok; Bae, Joongmyeon; Kim, Jung Hyun, MATERIALS RESEARCH BULLETIN, v.82, pp.126 - 129, 2016-10 | |
| Leaf Vein-Inspired Electrospraying System by Grafting Origami Seo, Young Chang; You, In-Seong; Park, Inyong; Kim, Sang Soo; Lee, Haeshin, CHEMISTRY OF MATERIALS, v.28, no.21, pp.7990 - 7996, 2016-11 | |
| 3D printed fluidic valves for remote operation via external magnetic field Kim, Seokbeom; Lee, Jungchul; Choi, Bumkyoo, INTERNATIONAL JOURNAL OF PRECISION ENGINEERING AND MANUFACTURING, v.17, no.7, pp.937 - 942, 2016-07 | |
| Copper Interconnects Based on Copper(I) Oxide Particle-Based Precursor Ink Technology-Material Composition Optimization and Reliability Lee, Hu Seung; Yang, Minyang, IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, v.16, no.4, pp.604 - 609, 2016-12 |
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