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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| A comparative study of the fatigue Behavior of SnAgCu and SnPb solder joints Kim, IH; Park, TS; Yang, SY; Lee, Soon-Bok, ADVANCES IN FRACTURE AND STRENGTH, PTS 1- 4, v.297-300, pp.831 - 836, 2005 | |
| Chip warpage damage model for ACA film type electronic packages Yang, SY; Kwon, WS; Lee, Soon-Bok; Paik, Kyung-Wook, ADVANCES IN FRACTURE AND STRENGTH, PTS 1- 4 BOOK SERIES: KEY ENGINEERING MATERIALS, v.297-300, no.2, pp.1 - 4, 2005 | |
| Realization of high sensitivity displacement field from moire interferometer with rough phase shifting mechanism and pattern matching technique Yang, SY; Lee, Soon-Bok, OPTICS AND LASERS IN ENGINEERING, v.43, no.6, pp.721 - 736, 2005-06 |
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