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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
Multi-directionally wrinkle-able textile OLEDs for clothing-type displays Choi, Seungyeop; Jo, Woosung; JEON, YONGMIN; Kwon, Seonil; Kwon, Jeong Hyun; SON, YOUNGHYUN; Kim, Junmo; Park, Junhong; Kim, Hyuncheol; Lee, Hoseung; Nam, Minwoo; Jeong, Eun Gyo; Shin, Jeong Bin; Kim, Taek-Soo; Choi, Kyung Cheol, NPJ FLEXIBLE ELECTRONICS, v.4, no.1, 2020-11 | |
| A soft and transparent contact lens for the wireless quantitative monitoring of intraocular pressure Kim, Joohee; Park, Jihun; Park, Young-Geun; Cha, Eunkyung; Ku, Minjae; An, Hyeon Seok; Lee, Kyoung-Pil; Huh, Man-Il; Kim, Junmo; Kim, Taek-Soo; Kim, Dai Woo; Kim, Hong Kyun; Park, Jang-Ung, NATURE BIOMEDICAL ENGINEERING, v.5, no.7, pp.772 - 782, 2021-07 | |
| A modulus-engineered multi-layer polymer film with mechanical robustness for the application to highly deformable substrate platform in stretchable electronics Kim, Youson; Kim, Junmo; kim, chanyoung; Kim, Taehyun; Lee, Chungryeol; Jeong, Kihoon; Jo, Woosung; Yoo, Seunghyup; Kim, Taek-Soo; Choi, Kyung Cheol; Im, Sung Gap, CHEMICAL ENGINEERING JOURNAL, v.431, no.2, 2022-03 | |
| Dual-Functional Self-Attachable and Stretchable Interface for Universal Three-Dimensional Modular Electronics Oh, Ji-Young; Hwang, Chi-Sun; Yang, Yong Suk; Song, Myoung; Kim, Junmo; Kim, Taek-Soo; Kim, Sujung; Oh, Himchan; Kang, Seung Youl; Pi, Jae-Eun; Koo, Jae Bon; Park, Chan Woo; Lee, Hyoyoung, ACS APPLIED MATERIALS & INTERFACES, v.14, no.43, pp.49303 - 49312, 2022-11 | |
| Enhancing predictability of thermal warpage by applying temperature-dependent Poisson's ratio of epoxy molding compound Kim, Junmo; Song, Myoung; Gu, Chang-Yeon; Ma, Sungwoo; Lee, Jin Hee; Lee, Woong-Sun; Kim, Taek-Soo, POLYMER TESTING, v.125, 2023-08 | |
| Geometrically engineered rigid island array for stretchable electronics capable of withstanding various deformation modes Yang, Jun Chang; Lee, Seungkyu; Ma, Boo Soo; Kim, Junmo; Song, Myoung; Kim, Su Yeong; Kim, Da Won; Kim, Taek-Soo; Park, Steve, SCIENCE ADVANCES, v.8, no.22, 2022-06 | |
| Evaluating Mechanical Properties of 100nm-Thick Atomic Layer Deposited Al2o3 as a Free-Standing Film Koo, Junmo; Lee, Sangmin; Kim, Junmo; Kim, Dong Hwan; Choi, Byoung-Ho; Kim, Taek-Soo; Shim, Joon Hyung, SCRIPTA MATERIALIA, v.187, pp.256 - 261, 2020-10 | |
| Reducing Bonding Temperature and Energy Consumption in Electronic Packaging Using Flash Electro-Thermal Carbon Fiber Heating Elements Park, Seong Yeon; On, Seung Yoon; Kim, Junmo; Lee, Jeonyoon; Kim, Taek-Soo; Wardle, Brian L.; Kim, Seong Su, ACS APPLIED MATERIALS & INTERFACES, v.15, no.32, pp.38750 - 38758, 2023-08 | |
| Electronic Packaging Enhancement Engineered by Reducing the Bonding Temperature via Modified Cure Cycles Park, Seong Yeon; On, Seung Yoon; Kim, Junmo; Lee, Jeonyoon; Kim, Taek-Soo; Wardle, Brian L.; Kim, Seong Su, ACS APPLIED MATERIALS & INTERFACES, v.15, no.8, pp.11024 - 11032, 2023-01 | |
| A hyperelastic adhesive forming multiple neutral planes even at extreme temperatures Jeong, Kihoon; Kim, Dohun; AHN, DAHYE; Yang, Chanhee; Kim, Junmo; Lee, ChangHyeon; Kim, Youson; LEE, CHUNGRYEOL; Park, Young-Sam; Lee, Seung-Hyun; Kim, Taek-Soo; Im, Sung Gap, CHEMICAL ENGINEERING JOURNAL, v.480, 2024-01 |
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