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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Moisture Effects on NCF Adhesion and Solder Joint Reliability of Chip-on-Board Assembly Using Cu Pillar/Sn-Ag Microbump Kim, Youngsoon; Yoon, Taeshik; Kim, Tae-Wan; Kim, Taek-Soo; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.3, pp.371 - 378, 2017-03 | |
| Comparison of Methods for Determining the Mechanical Properties of Semiconducting Polymer Films for Stretchable Electronics Rodriquez, Daniel; Kim, Jae Han; Root, Samuel E.; Fe, Zhuping; Boufflet, Pierre; Heeney, Martin; Kim, Taek-Soo; Lipomi, Darren J., ACS APPLIED MATERIALS INTERFACES, v.9, no.10, pp.8855 - 8862, 2017-03 | |
| Accelerated Degradation Due to Weakened Adhesion from Li-TFSI Additives in Perovskite Solar Cells Lee, Inhwa; Yun, Jae Hoon; Son, Hae Jung; Kim, Taek-Soo, ACS APPLIED MATERIALS INTERFACES, v.9, no.8, pp.7029 - 7035, 2017-03 | |
| Contact-free thermal expansion measurement of very soft elastomers using digital image correlation Lee, Tae-Ik; Kim, Min Sung; Kim, Taek-Soo, POLYMER TESTING, v.51, pp.181 - 189, 2016-05 | |
| Prediction of time-dependent swelling of flexible polymer substrates using hygro-mechanical finite element simulations Pyo, Jae-Bum; Lee, Tae-Ik; Kim, Cheolgyu; Kim, Min Sung; Kim, Taek-Soo, SOFT MATTER, v.12, no.18, pp.4135 - 4141, 2016-03 | |
| Reversible self-bending soft hydrogel microstructures with mechanically optimized designs Kim, Jongmin; Kim, Cheolgyu; Song, YoungShin; Jeong, Seong-Geun; Kim, Taek-Soo; Lee, Chang-Soo, CHEMICAL ENGINEERING JOURNAL, v.321, pp.384 - 393, 2017-08 | |
| Effect of Nanofiber Orientation on Nanofiber Solder Anisotropic Conductive Films Joint Properties and Bending Reliability of Flex-on-Flex Assembly Kim, Tae-Wan; Lee, Tae-Ik; Pan, Yan; Kim, Wansun; Zhang, Shuye; Kim, Taek-Soo; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.6, no.9, 2016-09 | |
| Extremely Robust and Patternable Electrodes for Copy-Paper-Based Electronics Ahn, Jaeho; Seo, Ji Won; Lee, Tae-Ik; Kwon, Donguk; Park, Inkyu; Kim, Taek-Soo; Lee, Jung-Yong, ACS APPLIED MATERIALS & INTERFACES, v.8, no.29, pp.19031 - 19037, 2016-07 | |
| Large area multi-stacked lithium-ion batteries for flexible and rollable applications Kim, Joo-Seong; Lee, Yonghee; Lee, Inhwa; Kim, Taek-Soo; Ryou, Myung-Hyun; Choi, Jang Wook, JOURNAL OF MATERIALS CHEMISTRY A, v.2, no.28, pp.10862 - 10868, 2014-02 | |
| Millipede-inspired structural design principle for high performance polysaccharide binders in silicon anodes Jeong, You Kyeong; Kwon, Tae-Woo; Lee, Inhwa; Kim, Taek-Soo; Coskun, Ali; Choi, Jang-Wook, ENERGY & ENVIRONMENTAL SCIENCE, v.8, no.4, pp.1224 - 1230, 2015-01 |
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