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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Efficient Welding of Silver Nanowire Networks without Post-Processing Lee, Jaemin; Lee, Inhwa; Kim, Taek-Soo; Lee, Jung-Yong, Small, v.9, no.17, pp.2887 - 2894, 2013-09 | |
| Comparison of Methods for Determining the Mechanical Properties of Semiconducting Polymer Films for Stretchable Electronics Rodriquez, Daniel; Kim, Jae Han; Root, Samuel E.; Fe, Zhuping; Boufflet, Pierre; Heeney, Martin; Kim, Taek-Soo; Lipomi, Darren J., ACS APPLIED MATERIALS INTERFACES, v.9, no.10, pp.8855 - 8862, 2017-03 | |
| Understanding mechanical behavior and reliability of organic electronic materials Kim, Jae Han; Lee, Inhwa; Kim, Taek-Soo; Rolston, Nicholas; Watson, Brian L.; Dauskardt, Reinhold H., MRS BULLETIN, v.42, no.2, pp.115 - 123, 2017-02 | |
| Comparison of Methods for Determining the Mechanical Properties of Semiconducting Polymer Films for Stretchable Electronics Rodriquez, Daniel; Kim, Jae Han; Root, Samuel E.; Fe, Zhuping; Boufflet, Pierre; Heeney, Martin; Kim, Taek-Soo; Lipomi, Darren J., ACS APPLIED MATERIALS INTERFACES, v.9, no.10, pp.8855 - 8862, 2017-03 | |
| Electromechanical diagnostic method for monitoring cracks in polymer electrolyte fuel cell electrodes Jang, Kyung-Lim; Kim, Sanwi; Jeong, Byeong-Heon; Oh, Jong-Gil; Hong, Bo Ki; Kim, Taek-Soo, INTERNATIONAL JOURNAL OF HYDROGEN ENERGY, v.42, no.16, pp.11644 - 11653, 2017-04 | |
Warpage Analysis of Electroplated Cu Films on Fiber-Reinforced Polymer Packaging Substrates Kim, Cheolgyu; Lee, Tae-Ik; Kim, Min Sung; Kim, Taek-Soo, POLYMERS, v.7, no.6, pp.985 - 1004, 2015-06 | |
| Mechanical Properties of Polymer-Fullerene Bulk Heterojunction Films: Role of Nanomorphology of Composite Films Kim, Jae Han; Noh, Jonghyeon; Choi, Hyesun; Lee, Jung-Yong; Kim, Taek-Soo, CHEMISTRY OF MATERIALS, v.29, no.9, pp.3954 - 3961, 2017-05 | |
| Solution-Assembled Blends of Regioregularity-Controlled Polythiophenes for Coexistence of Mechanical Resilience and Electronic Performance Kim, Hyeong Jun; Lee, Moo Yeol; Kim, Jin-Seong; Kim, Jae Han; Yu, Hojeong; Yun, Hong-Seok; Liao, Kin; Kim, Taek-Soo; Oh, Joon Hak; Kim, Bumjoon J., ACS APPLIED MATERIALS & INTERFACES, v.9, no.16, pp.14120 - 14128, 2017-04 | |
| Enhancing Mechanical Properties of Highly Efficient Polymer Solar Cells Using Size-Tuned Polymer Nanoparticles Kang, Dong Jin; Cho, Hanhee; Lee, Inhwa; Kim, Ki Hyun; Kim, Hyeongjun; Liao, Kin; Kim, Taek-Soo; Kim, Bum-Joon, ACS APPLIED MATERIALS & INTERFACES, v.7, no.4, pp.2668 - 2676, 2015-02 |
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