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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Reversible self-bending soft hydrogel microstructures with mechanically optimized designs Kim, Jongmin; Kim, Cheolgyu; Song, YoungShin; Jeong, Seong-Geun; Kim, Taek-Soo; Lee, Chang-Soo, CHEMICAL ENGINEERING JOURNAL, v.321, pp.384 - 393, 2017-08 | |
| Mechanism of warpage orientation rotation due to viscoelastic polymer substrates during thermal processing Kim, Cheolgyu; Lee, Tae-Ik; Kim, Min Sung; Kim, Taek-Soo, MICROELECTRONICS RELIABILITY, v.73, pp.136 - 145, 2017-06 | |
| Effects of the Mechanical Properties of Polymer Resin and the Conductive Ball Types of Anisotropic Conductive Films on the Bending Properties of Chip-in-Flex Package Kim, Young-Lyong; Lee, Tae-Ik; Kim, Ji-Hye; Kim, Wonsik; Kim, Taek-Soo; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.6, no.2, pp.200 - 207, 2016-02 | |
Warpage Analysis of Electroplated Cu Films on Fiber-Reinforced Polymer Packaging Substrates Kim, Cheolgyu; Lee, Tae-Ik; Kim, Min Sung; Kim, Taek-Soo, POLYMERS, v.7, no.6, pp.985 - 1004, 2015-06 | |
| Effect of anisotropic thermo-elastic properties of woven-fabric laminates on diagonal warpage of thin package substrates Lee, Tae-Ik; Kim, Cheolgyu; Pyo, Jae-Bum; Kim, Min Sung; Kim, Taek-Soo, COMPOSITE STRUCTURES, v.176, pp.973 - 981, 2017-09 | |
| An extended analytic model for the elastic properties of platelet-staggered composites and its application to 3D printed structures Kim, Youngsoo; Kim, Yongtae; Lee, Tae-Ik; Kim, Taek-Soo; Ryu, Seunghwa, COMPOSITE STRUCTURES, v.189, pp.27 - 36, 2018-04 |