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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Flash-Induced Self-Limited Plasmonic Welding of Silver Nanowire Network for Transparent Flexible Energy Harvester Park, Jung Hwan; Hwang, Geon-Tae; Kim, Shin-Ho; Seo, Jeongmin; Park, Hong-Jin; Yu, Kyoungsik; Kim, Taek-Soo; Lee, Keon Jae, ADVANCED MATERIALS, v.29, no.5, 2017-02 | |
| Effects of Ag addition on solid-state interfacial reactions between Sn-Ag-Cu solder and Cu substrate Yang, Ming; Ko, Yong Ho; Bang, Junghwan; Kim, Taek-Soo; Lee, Chang-Woo; Li, Mingyu, MATERIALS CHARACTERIZATION, v.124, pp.250 - 259, 2017-02 | |
| Comparison of Methods for Determining the Mechanical Properties of Semiconducting Polymer Films for Stretchable Electronics Rodriquez, Daniel; Kim, Jae Han; Root, Samuel E.; Fe, Zhuping; Boufflet, Pierre; Heeney, Martin; Kim, Taek-Soo; Lipomi, Darren J., ACS APPLIED MATERIALS INTERFACES, v.9, no.10, pp.8855 - 8862, 2017-03 | |
| Accelerated Degradation Due to Weakened Adhesion from Li-TFSI Additives in Perovskite Solar Cells Lee, Inhwa; Yun, Jae Hoon; Son, Hae Jung; Kim, Taek-Soo, ACS APPLIED MATERIALS INTERFACES, v.9, no.8, pp.7029 - 7035, 2017-03 | |
| Understanding mechanical behavior and reliability of organic electronic materials Kim, Jae Han; Lee, Inhwa; Kim, Taek-Soo; Rolston, Nicholas; Watson, Brian L.; Dauskardt, Reinhold H., MRS BULLETIN, v.42, no.2, pp.115 - 123, 2017-02 | |
| Moisture Effects on NCF Adhesion and Solder Joint Reliability of Chip-on-Board Assembly Using Cu Pillar/Sn-Ag Microbump Kim, Youngsoon; Yoon, Taeshik; Kim, Tae-Wan; Kim, Taek-Soo; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.3, pp.371 - 378, 2017-03 | |
| Comparison of Methods for Determining the Mechanical Properties of Semiconducting Polymer Films for Stretchable Electronics Rodriquez, Daniel; Kim, Jae Han; Root, Samuel E.; Fe, Zhuping; Boufflet, Pierre; Heeney, Martin; Kim, Taek-Soo; Lipomi, Darren J., ACS APPLIED MATERIALS INTERFACES, v.9, no.10, pp.8855 - 8862, 2017-03 | |
| Accelerated Degradation Due to Weakened Adhesion from Li-TFSI Additives in Perovskite Solar Cells Lee, Inhwa; Yun, Jae Hoon; Son, Hae Jung; Kim, Taek-Soo, ACS APPLIED MATERIALS INTERFACES, v.9, no.8, pp.7029 - 7035, 2017-03 | |
| Reversible self-bending soft hydrogel microstructures with mechanically optimized designs Kim, Jongmin; Kim, Cheolgyu; Song, YoungShin; Jeong, Seong-Geun; Kim, Taek-Soo; Lee, Chang-Soo, CHEMICAL ENGINEERING JOURNAL, v.321, pp.384 - 393, 2017-08 | |
| Mechanism of warpage orientation rotation due to viscoelastic polymer substrates during thermal processing Kim, Cheolgyu; Lee, Tae-Ik; Kim, Min Sung; Kim, Taek-Soo, MICROELECTRONICS RELIABILITY, v.73, pp.136 - 145, 2017-06 |
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