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Results 1-10 of 16 (Search time: 0.004 seconds).

NO Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)
1
유연 기판 위 적층 필름의 굽힘 탄성계수 측정

Lee, Tae-Ik; Kim, Choelgyu; Kim, Min Sung; Kim, Taek-Soo, 마이크로전자 및 패키징학회지, v.23, no.3, pp.63 - 67, 2016-09

2
Contact-free thermal expansion measurement of very soft elastomers using digital image correlation

Lee, Tae-Ik; Kim, Min Sung; Kim, Taek-Soo, POLYMER TESTING, v.51, pp.181 - 189, 2016-05

3
Prediction of time-dependent swelling of flexible polymer substrates using hygro-mechanical finite element simulations

Pyo, Jae-Bum; Lee, Tae-Ik; Kim, Cheolgyu; Kim, Min Sung; Kim, Taek-Soo, SOFT MATTER, v.12, no.18, pp.4135 - 4141, 2016-03

4
Effect of Nanofiber Orientation on Nanofiber Solder Anisotropic Conductive Films Joint Properties and Bending Reliability of Flex-on-Flex Assembly

Kim, Tae-Wan; Lee, Tae-Ik; Pan, Yan; Kim, Wansun; Zhang, Shuye; Kim, Taek-Soo; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.6, no.9, 2016-09

5
Extremely Robust and Patternable Electrodes for Copy-Paper-Based Electronics

Ahn, Jaeho; Seo, Ji Won; Lee, Tae-Ik; Kwon, Donguk; Park, Inkyu; Kim, Taek-Soo; Lee, Jung-Yong, ACS APPLIED MATERIALS & INTERFACES, v.8, no.29, pp.19031 - 19037, 2016-07

6
Highly Sensitive, Flexible, and Wearable Pressure Sensor Based on a Giant Piezocapacitive Effect of Three-Dimensional Microporous Elastomeric Dielectric Layer

Kwon, Donguk; Lee, Tae-Ik; Shim, Jongmin; Ryu, Seunghwa; Kim, Min Seong; Kim, Seunghwan; Kim, Taek-Soo; Park, Inkyu, ACS APPLIED MATERIALS & INTERFACES, v.8, no.26, pp.16922 - 16931, 2016-07

7
Simultaneously Enhancing the Cohesion and Electrical Conductivity of PEDOT:PSS Conductive Polymer Films using DMSO Additives

Lee, Inhwa; Kim, Gun Woo; Yang, Minyang; Kim, Taek-Soo, ACS APPLIED MATERIALS INTERFACES, v.8, no.1, pp.302 - 310, 2016-01

8
Effects of the Mechanical Properties of Polymer Resin and the Conductive Ball Types of Anisotropic Conductive Films on the Bending Properties of Chip-in-Flex Package

Kim, Young-Lyong; Lee, Tae-Ik; Kim, Ji-Hye; Kim, Wonsik; Kim, Taek-Soo; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.6, no.2, pp.200 - 207, 2016-02

9
Bending Properties of Anisotropic Conductive Films Assembled Chip-in-Flex Packages for Wearable Electronics Applications

Kim, Ji-Hye; Lee, Tae-Ik; Shin, Ji Won; Kim, Taek-Soo; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.6, no.2, pp.208 - 215, 2016-02

10
Controlling Interfacial Reactions and Intermetallic Compound Growth at the Interface of a Lead-free Solder Joint with Layer-by-Layer Transferred Graphene

Ko, Yong Ho; Lee, Jong-Dae; Yoon, Taeshik; Lee, Chang-Woo; Kim, Taek-Soo, ACS APPLIED MATERIALS INTERFACES, v.8, no.8, pp.5679 - 5686, 2016-03

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