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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| 유연 기판 위 적층 필름의 굽힘 탄성계수 측정 Lee, Tae-Ik; Kim, Choelgyu; Kim, Min Sung; Kim, Taek-Soo, 마이크로전자 및 패키징학회지, v.23, no.3, pp.63 - 67, 2016-09 | |
| Contact-free thermal expansion measurement of very soft elastomers using digital image correlation Lee, Tae-Ik; Kim, Min Sung; Kim, Taek-Soo, POLYMER TESTING, v.51, pp.181 - 189, 2016-05 | |
| Prediction of time-dependent swelling of flexible polymer substrates using hygro-mechanical finite element simulations Pyo, Jae-Bum; Lee, Tae-Ik; Kim, Cheolgyu; Kim, Min Sung; Kim, Taek-Soo, SOFT MATTER, v.12, no.18, pp.4135 - 4141, 2016-03 | |
| Mechanism of warpage orientation rotation due to viscoelastic polymer substrates during thermal processing Kim, Cheolgyu; Lee, Tae-Ik; Kim, Min Sung; Kim, Taek-Soo, MICROELECTRONICS RELIABILITY, v.73, pp.136 - 145, 2017-06 | |
Warpage Analysis of Electroplated Cu Films on Fiber-Reinforced Polymer Packaging Substrates Kim, Cheolgyu; Lee, Tae-Ik; Kim, Min Sung; Kim, Taek-Soo, POLYMERS, v.7, no.6, pp.985 - 1004, 2015-06 | |
| Effect of anisotropic thermo-elastic properties of woven-fabric laminates on diagonal warpage of thin package substrates Lee, Tae-Ik; Kim, Cheolgyu; Pyo, Jae-Bum; Kim, Min Sung; Kim, Taek-Soo, COMPOSITE STRUCTURES, v.176, pp.973 - 981, 2017-09 | |
| Flexural and tensile moduli of flexible FR4 substrates Lee, Tae-Ik; Kim, Cheolgyu; Kim, Min Sung; Kim, Taek-Soo, POLYMER TESTING, v.53, pp.70 - 76, 2016-08 |
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