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NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
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Warpage Analysis of Electroplated Cu Films on Fiber-Reinforced Polymer Packaging Substrates Kim, Cheolgyu; Lee, Tae-Ik; Kim, Min Sung; Kim, Taek-Soo, POLYMERS, v.7, no.6, pp.985 - 1004, 2015-06 | |
Flexible, highly efficient all-polymer solar cells Kim, Taesu; Kim, Jae-Han; Kang, Tae Eui; Lee, Changyeon; Kang, Hyunbum; Shin, Minkwan; Wang, Cheng; Ma, Biwu; Jeong, Unyong; Kim, Taek-Soo; Kim, Bumjoon J., NATURE COMMUNICATIONS, v.6, 2015-10 |
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