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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
Warpage Analysis of Electroplated Cu Films on Fiber-Reinforced Polymer Packaging Substrates Kim, Cheolgyu; Lee, Tae-Ik; Kim, Min Sung; Kim, Taek-Soo, POLYMERS, v.7, no.6, pp.985 - 1004, 2015-06 | |
| Flash-Induced Stretchable Cu Conductor via Multiscale-Interfacial Couplings Park, Jung Hwan; Seo, Jeongmin; Kim, Cheolgyu; Joe, Daniel Juhyung; Lee, Han Eol; Im, Tae Hong; Seok, Jae Young; Jeong, Chang Kyu; Ma, Boo Soo; Park, Hyung Kun; Kim, Taek-Soo; Lee, Keon Jae, ADVANCED SCIENCE, v.5, no.11, pp.1801146, 2018-10 |
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