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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Controlled multiple neutral planes by low elastic modulus adhesive for flexible organic photovoltaics Kim, Wansun; Lee, Inhwa; Kim, Dong Yoon; Yu, Youn-Yeol; Jung, Hae-Yoon; Kwon, Seyeoul; Park, Weon Seo; Kim, Taek-Soo, NANOTECHNOLOGY, v.28, no.19, 2017-05 | |
Temperature-Controlled Direct Imprinting of Ag Ionic Ink: Flexible Metal Grid Transparent Conductors with Enhanced Electromechanical Durability Oh, Yong Suk; Choi, Hyesun; Lee, Jaeho; Lee, Hyunwoo; Choi, Dong Yun; Lee, Sung Uk; Yun, Kyeong-Soo; Yoo, Seunghyup; Kim, Taek-Soo; Park, Inkyu; Sung, Hyung Jin, SCIENTIFIC REPORTS, v.7, 2017-09 | |
| Electromechanical diagnostic method for monitoring cracks in polymer electrolyte fuel cell electrodes Jang, Kyung-Lim; Kim, Sanwi; Jeong, Byeong-Heon; Oh, Jong-Gil; Hong, Bo Ki; Kim, Taek-Soo, INTERNATIONAL JOURNAL OF HYDROGEN ENERGY, v.42, no.16, pp.11644 - 11653, 2017-04 | |
| Nanotransplantation Printing of Crystallographic-Orientation-Controlled Single-Crystalline Nanowire Arrays on Diverse Surfaces Han, Hyeuk Jin; Jeong, Jae Won; Yang, Se Ryeun; Kim, Cheolgyu; Yoo, Hyeon Gyun; Yoon, Jun-Bo; Park, Jaehong; Lee, Keon Jae; Kim, Taek-Soo; Kim, Seong-Woong; Jung, Yeon Sik, ACS NANO, v.11, no.11, pp.11642 - 11652, 2017-11 | |
| Cooptimization of Adhesion and Power Conversion Efficiency of Organic Solar Cells by Controlling Surface Energy of Buffer Layers Lee, Inhwa; Noh, Jonghyeon; Lee, Jung-Yong; Kim, Taek-Soo, ACS APPLIED MATERIALS & INTERFACES, v.9, no.42, pp.37395 - 37401, 2017-09 | |
| Plasmonic-Tuned Flash Cu Nanowelding with Ultrafast Photochemical-Reducing and Interlocking on Flexible Plastics Park, Jung Hwan; Han, Seungyong; Kim, Dongkwan; You, Byoung Kuk; Joe, Daniel Juhyung; Hong, Sukjoon; Seo, Jeongmin; Kwon, Jinhyeong; Jeong, Chang Kyu; Park, Hong-Jin; Kim, Taek-Soo; Ko, Seung Hwan; Lee, Keon Jae, ADVANCED FUNCTIONAL MATERIALS, v.27, no.29, 2017-08 | |
| The Effect of Anisotropic Conductive Films Adhesion on the Bending Reliability of Chip-in-Flex Packages for Wearable Electronics Applications Kim, Ji-Hye; Lee, Tae-Ik; Kim, Taek-Soo; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.10, pp.1583 - 1591, 2017-10 | |
| Effect of anisotropic thermo-elastic properties of woven-fabric laminates on diagonal warpage of thin package substrates Lee, Tae-Ik; Kim, Cheolgyu; Pyo, Jae-Bum; Kim, Min Sung; Kim, Taek-Soo, COMPOSITE STRUCTURES, v.176, pp.973 - 981, 2017-09 | |
| Mechanical Properties of Polymer-Fullerene Bulk Heterojunction Films: Role of Nanomorphology of Composite Films Kim, Jae Han; Noh, Jonghyeon; Choi, Hyesun; Lee, Jung-Yong; Kim, Taek-Soo, CHEMISTRY OF MATERIALS, v.29, no.9, pp.3954 - 3961, 2017-05 | |
| Facilitated embedding of silver nanowires into conformally-coated iCVD polymer films deposited on cloth for robust wearable electronics Seo, Ji Won; Joo, Munkyu; Ahn, Jaeho; Lee, Tae-Ik; Kim, Taek-Soo; Im, Sung Gap; Lee, Jung-Yong, NANOSCALE, v.9, no.10, pp.3399 - 3407, 2017-03 |
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