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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Mechanism of warpage orientation rotation due to viscoelastic polymer substrates during thermal processing Kim, Cheolgyu; Lee, Tae-Ik; Kim, Min Sung; Kim, Taek-Soo, MICROELECTRONICS RELIABILITY, v.73, pp.136 - 145, 2017-06 | |
| The Effect of Anisotropic Conductive Films Adhesion on the Bending Reliability of Chip-in-Flex Packages for Wearable Electronics Applications Kim, Ji-Hye; Lee, Tae-Ik; Kim, Taek-Soo; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.10, pp.1583 - 1591, 2017-10 | |
| Effect of anisotropic thermo-elastic properties of woven-fabric laminates on diagonal warpage of thin package substrates Lee, Tae-Ik; Kim, Cheolgyu; Pyo, Jae-Bum; Kim, Min Sung; Kim, Taek-Soo, COMPOSITE STRUCTURES, v.176, pp.973 - 981, 2017-09 | |
| Facilitated embedding of silver nanowires into conformally-coated iCVD polymer films deposited on cloth for robust wearable electronics Seo, Ji Won; Joo, Munkyu; Ahn, Jaeho; Lee, Tae-Ik; Kim, Taek-Soo; Im, Sung Gap; Lee, Jung-Yong, NANOSCALE, v.9, no.10, pp.3399 - 3407, 2017-03 |
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